Movable Mounting Bracket for Thermal Contact in Communication Units

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Solution Overview

Problem

Conventional communication devices face challenges in achieving good thermal contact between the main unit and the heat transfer pad due to shear forces when using wall-mounting methods, which affect heat dissipation efficiency.

Innovation Solution

A communication device with a movable mounting bracket and positioning components that allow the main unit to be initially positioned away from the heat-absorbing surface, ensuring good thermal contact by preventing direct contact during assembly, and allowing for easy maintenance without shear forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the main unit is fixed using wall-mounting holes and hooks, then the main unit can be securely suspended, but shear forces occur between the main unit and heat transfer pad, preventing good thermal contact

Engineering Contradiction:
Improvethermal contact qualityVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The mounting bracket is designed to be movable relative to the bottom cover between a pre-installation position and an installation position through a guiding structure. This dynamic positioning allows the bracket to be moved into direct contact with the heat dissipation module, eliminating shear forces and ensuring good thermal contact between the main unit and heat transfer pad.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention extracts the mounting bracket from its traditional fixed position and separates it from the heat dissipation module contact path. By making the bracket movable and positioning it away from the heat-absorbing surface during pre-installation, the design eliminates the interference of the bracket between the main unit and heat transfer pad, thereby ensuring optimal thermal contact.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of manufacture

If the mounting bracket is positioned close to the heat-absorbing surface, then thermal contact is improved, but the main unit cannot be pre-assembled on the housing assembly

Engineering Contradiction:
Improvepre-assembly capabilityVSAvoidthermal contact quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The mounting bracket is designed with movable capability between two distinct positions. During pre-assembly, the bracket is positioned away from the heat-absorbing surface, allowing easy assembly of the main unit. During final installation, the bracket is moved to contact the heat dissipation module, ensuring good thermal contact. This dynamic positioning resolves the contradiction between pre-assembly ease and thermal contact quality.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The design allows the main unit to be pre-assembled on the housing assembly with the mounting bracket in the pre-installation position (away from the heat-absorbing surface). After pre-assembly is completed, the bracket is then moved to the installation position to establish thermal contact, separating the pre-assembly process from the thermal contact establishment process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures effective thermal contact between the main unit and the heat dissipation module, maintaining heat dissipation performance and facilitating easy maintenance by preventing direct contact and shear forces.

Implementation Method 1

the heat dissipation module has a heat-absorbing surface... the communication main unit is in physical contact with the heat-absorbing surface of the heat dissipation module

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12621588B2Communication device
Publication Date: 2026.05.05 GEMTEK TECH CO LTD
  • US12621588B2 patent drawing
  • US12621588B2 patent drawing
  • US12621588B2 patent drawing

AI summary

A communication device includes a housing assembly, a heat dissipation module and a communication main unit. The housing assembly includes a bottom cover, a mounting bracket and a positioning component. The mounting bracket is movably disposed on the bottom cover and movable between an installation position and a pre-installation position via a guiding structure. The positioning component is connected to the bottom cover and configured to fix the mounting bracket in the installation position in a detachable manner. The heat dissipation module is fixed to the bottom cover. The mounting bracket is located farther away from a heat-absorbing surface of the heat dissipation module when in the pre-installation position than in the installation position. The communication main unit is detachably disposed on the mounting bracket. When the mounting bracket is in the installation position, the communication main unit is in physical contact with the heat-absorbing surface.