Movable Cage Assembly for Immersion Cooling Expansion Card Access

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Solution Overview

Problem

The immersion cooling system for expansion cards faces challenges with space efficiency, as the motherboards with expansion cards occupy a significant amount of space, making it difficult to replace the expansion cards in the narrow system.

Innovation Solution

The electronic device incorporates a cage assembly with a fixed frame and movable frames, allowing the motherboard with expansion cards to be mounted on the movable frames, which can be integrated with the cage assembly, reducing space occupation and enabling easier replacement of expansion cards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the motherboard with expansion cards is fixed in the immersion cooling system, then the structure is stable, but the expansion cards are difficult to replace due to narrow space

Engineering Contradiction:
Improveease of replacementVSAvoidstructural complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent applies the dynamics principle by transforming the fixed mounting structure into a movable one. The motherboard is mounted on a movable frame that can slide along guide rails within the cage assembly, allowing the motherboard and expansion cards to be easily accessed and replaced by moving the entire assembly, thereby resolving the contradiction between structural stability and ease of replacement.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent segments the mounting structure into a fixed frame and a movable frame. The fixed frame provides structural stability and support, while the movable frame carries the motherboard and can be independently moved for maintenance purposes. This segmentation allows the system to simultaneously achieve stability and ease of operation.

Inventive Principle:
Principle #1Segmentation

2Productivity

If multiple expansion cards are mounted on the motherboard, then the computing capability is enhanced, but the overall size and space occupation are increased

Engineering Contradiction:
Improvecomputing capabilityVSAvoidspace occupation
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The patent merges multiple expansion cards onto a single motherboard, which is then mounted on a movable frame within a compact cage assembly. This combining approach allows multiple high-capacity cards to be installed in a space-efficient manner, enhancing computing capability without proportionally increasing the overall volume occupied in the immersion cooling system.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent optimizes the spatial arrangement by utilizing vertical space and three-dimensional positioning within the cage assembly. The movable frame design allows the motherboard with multiple expansion cards to be positioned efficiently, maximizing the use of available space in the immersion cooling system while maintaining high computing capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If the motherboard is immersed in coolant for cooling, then the heat dissipation is improved, but the access and replacement of expansion cards become difficult

Engineering Contradiction:
Improveheat dissipationVSAvoidaccessibility
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent applies dynamics by designing a movable frame that can be easily extracted from the immersion cooling system. The motherboard remains immersed in the coolant for effective heat dissipation during operation, but the movable frame can be quickly removed when maintenance is needed, providing excellent accessibility to the expansion cards without compromising cooling performance.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The movable frame acts as an intermediary between the immersion cooling system and the motherboard. It allows the motherboard to be cooled effectively when immersed while providing a convenient interface for removal and replacement, thus mediating between the conflicting requirements of heat dissipation and accessibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250056751A1Electronic device and immersion cooling system
Publication Date: 2025.02.13 COOLER MASTER CO LTD
  • US20250056751A1 patent drawing
  • US20250056751A1 patent drawing
  • US20250056751A1 patent drawing

AI summary

An immersion cooling system includes an immersion tank and at least one electronic device. The immersion tank is configured to accommodate a coolant. The at least one electronic device is disposed in the immersion tank, and includes a cage assembly, at least one motherboard and a plurality of expansion cards. The cage assembly includes a fixed frame and at least one movable frame. The at least one movable frame are movably disposed on the fixed frame. The at least one motherboard is mounted on the at least one movable frame. The plurality of expansion cards are mounted on the at least one motherboard.