Movable Support Chuck for Plasma Cleaning of Substrate Edges
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Solution Overview
Problem
Existing substrate treating apparatuses struggle to efficiently remove thin films formed on the edge and lower surfaces of substrates during processes like Chemical Vapor Deposition, leading to production issues in semiconductor manufacturing.
Innovation Solution
A substrate treating apparatus with a support unit featuring a chuck, a moving plate, and a lifting member that allows for controlled exposure of the edge region to plasma, enabling simultaneous treatment of both the upper and lower surfaces of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is placed on a fixed support plate with the rear surface not exposed to the outside, then the substrate is stable during treatment, but plasma cannot flow into the lower surface of the substrate and thin films on the edge of the rear surface cannot be removed
Solution Approach 1:
The support plate is designed with a movable rear surface that can be dynamically adjusted between a first position (where the edge region is exposed to plasma) and a second position (where the entire lower surface is supported). This dynamic configuration allows the system to adapt between different treatment requirements without requiring multiple separate apparatuses.
Solution Approach 2:
The support plate is divided into a front surface portion and a rear surface portion that can move relative to each other. The rear surface portion can be selectively positioned to either support the substrate or expose the edge region to plasma, enabling segmented control of substrate exposure areas during different treatment phases.
2Manufacturing precision
If the lift pin lifts the substrate to allow plasma introduction into the lower surface, then thin films can be removed, but the position of the support plate is physically limited and process control is limited
Solution Approach 1:
The rear surface of the support plate is designed to be movable along the vertical direction, enabling continuous adjustment of the substrate's lower surface exposure area. This dynamic adjustment capability provides flexible process control that is not limited by fixed support plate positions.
Solution Approach 2:
The system changes the exposure area parameter of the substrate lower surface by moving the rear surface of the support plate. This allows continuous variation of the treatment area from fully exposed to fully supported, providing adaptable process control for different treatment requirements.
3Manufacturing precision
If the substrate is transferred to a separate substrate treating apparatus to remove thin films from the rear surface edge, then complete film removal is achieved, but additional transfer time is consumed and productivity is degraded
Solution Approach 1:
The support plate integrates both upper surface treatment capability and lower surface edge treatment capability in a single apparatus. By merging these functions, the system eliminates the need for substrate transfer between separate treatment apparatuses, thereby improving productivity while maintaining comprehensive film removal capability.
Solution Approach 2:
The support plate is designed as a multi-functional component that can perform both upper surface treatment (when the rear surface is in the second position) and lower surface edge treatment (when the rear surface is in the first position). This universal design allows a single apparatus to handle complete substrate treatment without requiring multiple specialized devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively removes thin films from both the upper and lower surfaces of the substrate edge region, improving productivity by integrating the treatment process into a single apparatus without additional transfer steps.
Implementation Method 1
a power supply unit configured to generate an electric field in the treating space and generate plasma from process gas or a treatment fluid supplied to the treating space
Implementation Method 2
a lifting member configured to change an exposed area of an edge region of the substrate supported by the chuck for the treating space by relatively moving the moving plate in an upper or lower direction with respect to the chuck
Implementation Method 3
The ashing, etching, or strip process is performed when ions and radical particles contained in the plasma collide or react with the membrane on the substrate
Data Source
AI summary
The present invention provides a support unit included in an apparatus for treating a substrate by using plasma. The support unit may include: a chuck configured to support a lower surface of the substrate; a moving plate provided to surround the chuck when viewed from above; and a lifting member configured to change an exposed area of an edge region of the substrate supported by the chuck for the treating space by relatively moving the moving plate in an upper or lower direction with respect to the chuck.