Movable Computer Housing Lower Portion for Airflow Management
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Solution Overview
Problem
Notebook computers face challenges in efficiently dissipating heat due to their thin form factor, which restricts airflow and increases pressure drop, limiting cooling system efficiency without increasing the apparent unit thickness.
Innovation Solution
Incorporating a pressure drop reducing mechanism, such as an articulated thermal door, that moves the lower portion of the housing away from the upper portion, creating a larger gap for airflow and reducing pressure drop across the blower, thereby enhancing airflow and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the housing is designed with a thin form factor, then the portability is improved, but the airflow is restricted and pressure drop increases
Solution Approach 1:
The housing incorporates a movable lower portion that can be dynamically adjusted relative to the upper portion. This dynamic structure allows the gap between portions to be varied, optimizing airflow paths when needed while maintaining a compact closed form when portability is prioritized.
Solution Approach 2:
The invention introduces an additional degree of freedom by allowing the lower portion to move away from the upper portion in the vertical dimension. This creates a variable three-dimensional space for airflow, transforming the fixed thin profile into an adaptable structure that can expand the cooling volume when required.
2Productivity
If the lower portion is moved away from the upper portion, then the airflow is increased and pressure drop is reduced, but the device complexity increases
Solution Approach 1:
The housing is segmented into an upper portion and a movable lower portion that can be independently positioned. This segmentation allows the lower portion to be moved away from the upper portion to create enhanced airflow paths without requiring complete structural redesign of the entire housing.
3Stress or pressure
If the gap between upper and lower portions is increased, then the pressure drop is reduced, but the housing thickness increases
Solution Approach 1:
The housing incorporates a movable lower portion that can be dynamically adjusted relative to the upper portion. This dynamic structure allows the gap between portions to be varied, optimizing airflow paths when needed while maintaining a compact closed form when portability is prioritized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for improved airflow and heat dissipation without increasing the computer's thickness, effectively addressing the limitations of heat transfer in thin notebook computer designs while maintaining high performance.
Implementation Method 1
a pressure drop reducing mechanism configured to increase air airflow between the upper portion and the lower portion by moving the lower portion away from the upper portion
Data Source
AI summary
According to various embodiments, a housing for a computer system may be provided. The housing may include: an upper portion configured to hold an input device of the computer system; a lower portion comprising a foot of the housing for the computer system; and a pressure drop reducing mechanism configured to increase an airflow between the upper portion and the lower portion by moving the lower portion away from the upper portion.