Movable Conductive Pillar Probe Card Signal Integrity

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Solution Overview

Problem

Conventional probe card structures for high-frequency testing face issues such as increased cost, long manufacturing time, and the inability to repair broken conductive traces, due to the need for extended coaxial cables and complex wiring designs.

Innovation Solution

The introduction of a movable conductive pillar that passes through through holes in the substrate, allowing for simplified signal transmission and reduced risk of conductive trace breakage, enabling efficient signal path design and cost-effective manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a coaxial cable is extended from the probe side to the tester side, then the signal can be transmitted, but the cost and manufacturing time increase

Engineering Contradiction:
Improvesignal transmissionVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The signal transmission path is segmented into distinct functional components: probes on the probe side, a movable conductive pillar as a bridge, and conductive traces on the tester side. This segmentation allows each component to be optimized independently and simplifies assembly, reducing manufacturing time while maintaining reliable signal transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A movable conductive pillar is introduced as an intermediary component between the probe side and tester side. This pillar serves as a flexible bridge that can be easily positioned and connected, eliminating the need for extended coaxial cables and reducing both manufacturing complexity and time.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a coaxial cable is extended from the probe side to the tester side, then the signal can be transmitted, but the cost increases

Engineering Contradiction:
Improvesignal transmissionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The signal transmission path is segmented into distinct functional components: probes on the probe side, a movable conductive pillar as a bridge, and conductive traces on the tester side. This segmentation allows each component to be optimized independently and simplifies assembly, reducing manufacturing time while maintaining reliable signal transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A movable conductive pillar is introduced as an intermediary component between the probe side and tester side. This pillar serves as a flexible bridge that can be easily positioned and connected, eliminating the need for extended coaxial cables and reducing both manufacturing complexity and time.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If conductive traces are arranged in the substrate, then signal transmission is enabled, but the traces can break and cannot be repaired

Engineering Contradiction:
Improvesignal transmissionVSAvoidconductive trace repair
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The conductive connection system transitions from a static trace arrangement to a dynamic, movable conductive pillar structure. This movable pillar can be repositioned or replaced if damaged, providing flexibility and repairability that rigid conductive traces lack.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The movable conductive pillar is designed as a replaceable component. If the pillar or its connections are damaged, the entire pillar assembly can be removed and replaced without affecting the substrate or probes, enabling easy repair and recovery of the signal transmission path.

Inventive Principle:
Principle #34Discarding and recovering

4Productivity

If probes are arranged densely for high-frequency testing, then testing capability is improved, but signal interference increases

Engineering Contradiction:
Improvetesting capabilityVSAvoidsignal interference
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The movable conductive pillar acts as an intermediary that isolates the probe side from the tester side, creating a controlled signal transmission path. This intermediary structure helps prevent signal interference between densely arranged probes while maintaining testing capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The movable conductive pillar provides a flexible connection mechanism that can be configured to minimize signal interference. Its movable nature allows it to be positioned optimally to avoid interference paths while maintaining electrical connectivity.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies the wiring design, reduces the likelihood of conductive trace breaks, shortens testing time, and lowers manufacturing costs by allowing for the reuse of probes with replaceable conductive pillars, while maintaining signal integrity.

Implementation Method 1

The at least one movable conductive pillar can be movably passed through a corresponding one of the first through hole. The signal path is disposed on the second surface of the substrate, so that the probe is electrically connected to the movable conductive pillar.

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20240168057A1Probe card for high-frequency testing
Publication Date: 2024.05.23 XINGR HOLDINGS PTE LTD
  • US20240168057A1 patent drawing
  • US20240168057A1 patent drawing
  • US20240168057A1 patent drawing

AI summary

A probe card for high-frequency testing is provided. The probe card includes a substrate, a flexible substrate, a probe, and at least one movable conductive pillar. The substrate has a first surface, a second surface, and at least one first through hole. The flexible substrate is disposed on the second surface of the substrate and has at least one second through hole. The second through hole and the first through hole correspond to each other. The probe is disposed on the second surface of the substrate, and is electrically connected to the flexible substrate. The movable conductive pillar movably passes through the first through hole and the second through hole.