Movable Cooling Component for Removable Electronic Devices
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Solution Overview
Problem
Removable electronic devices, such as transceivers and NVMe storage drives, generate excessive waste heat that can degrade performance, reliability, and life expectancy if not adequately dissipated, and existing cooling solutions face challenges in maintaining thermal contact due to surface imperfections and repetitive connection/disconnection damage to thermal interfacing materials.
Innovation Solution
A host electronic device with a movable cooling component and flexible arms that allow the cooling component to drop into position for thermal contact without contacting thermal interfacing material during device insertion/removal, using biasing members to maintain optimal contact force and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling component is used to dissipate waste heat from the removable electronic device, then thermal regulation is improved, but the thermal interfacing material may be damaged during repetitive connection and disconnection operations
Solution Approach 1:
The cooling component is designed to be movable between a first position (retracted from the removable electronic device) and a second position (engaged with the removable electronic device). This dynamic positioning allows the cooling component to avoid interfering with insertion and removal operations while maintaining thermal contact during operation, thereby preventing damage to the thermal interfacing material
Solution Approach 2:
The system separates the cooling function from the connection/disconnection function. The cooling component operates independently on a different plane of motion, allowing the removable electronic device to be inserted and removed without contacting the thermal interfacing material, thus resolving the contradiction between thermal regulation and material durability
2Temperature
If the cooling component maintains constant contact with the removable electronic device, then optimal thermal contact is achieved, but the thermal interfacing material suffers from repetitive force damage during connection and disconnection
Solution Approach 1:
The cooling component transitions from a static constant-contact design to a dynamic movable design. It maintains optimal thermal contact during operation (second position) but retracts during connection and disconnection (first position), eliminating repetitive force damage while preserving thermal efficiency during use
Solution Approach 2:
The cooling component is positioned in advance to avoid interference during insertion and removal operations. By being in the retracted first position before connection/disconnection occurs, it prevents damage to the thermal interfacing material before the harmful action can occur
3Device complexity
If the cooling component is fixed in position, then structural simplicity is maintained, but it cannot adapt to the movement and positioning requirements during device insertion and removal
Solution Approach 1:
The cooling component incorporates movability to adapt to different operational states. It can dynamically position itself in the first position during connection/disconnection and the second position during operation, providing the necessary adaptability while maintaining relatively simple structural implementation through guide rails and biasing members
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates waste heat without damaging thermal interfacing materials and facilitates easy connection/disconnection of removable devices, preventing repetitive force-related damage and maintaining optimal thermal contact.
Implementation Method 1
establishing a thermal contact with a heat generating component of the removable electronic device... effectively dissipates waste heat... maintaining optimal thermal contact
Implementation Method 2
using biasing members to maintain optimal contact force... prevent damage
Data Source
AI summary
Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.