Movable Coupling Liquid Cooling for Multi-Device Chassis
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Solution Overview
Problem
Existing liquid cooling systems for information handling systems in multi-device chassis are inefficient in terms of size, power consumption, and risk of damage due to leakage, as they require a large volume and can cause extensive damage if a leak occurs.
Innovation Solution
A movable coupling liquid cooling system that allows computing devices to be mounted to a multi-device chassis with a liquid cooling subsystem, enabling heat transfer while allowing the computing device to move relative to the chassis, thus reducing the need for extensive cooling systems within individual devices and minimizing damage from leaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are provided in individual computing devices, then heat dissipation is achieved, but the size of computing devices increases
Solution Approach 1:
The liquid cooling system is extracted from the individual computing device and relocated to the multi-device chassis. The computing device mounting element interfaces with the device to receive heat, while the liquid cooling subsystem resides in the chassis mounting element, separating the cooling function from the computing device itself.
Solution Approach 2:
The liquid cooling subsystem is merged into the multi-device chassis structure, where it can serve multiple computing devices simultaneously. The chassis mounting element integrates the cooling infrastructure at the chassis level rather than requiring separate cooling systems in each device.
2Temperature
If liquid cooling systems are provided in individual computing devices, then heat dissipation is achieved, but power consumption increases
Solution Approach 1:
Multiple computing devices share a common liquid cooling subsystem in the chassis, consolidating redundant cooling components into a single shared infrastructure. This reduces the total power consumption compared to each device having its own independent cooling system.
3Temperature
If liquid cooling systems are provided in individual computing devices, then heat dissipation is achieved, but damage from leakage increases
Solution Approach 1:
The liquid cooling system is extracted from the computing device and relocated to the chassis, isolating the liquid containment away from sensitive computing components. This reduces the potential damage from leakage by positioning the liquid system at a distance from vulnerable electronics.
Solution Approach 2:
The mounting elements serve as intermediaries between the computing device and the liquid cooling subsystem. The computing device mounting element transfers heat without direct liquid contact, and the chassis mounting element contains the liquid system, creating a protective barrier that limits potential leakage damage.
4Stability of the object's composition
If computing devices are fixed in multi-device chassis, then structural stability is maintained, but adaptability decreases
Solution Approach 1:
The mounting elements incorporate movable coupling mechanisms that enable dynamic adjustment. The computing device mounting element can move relative to the chassis mounting element, allowing devices to be installed, removed, or repositioned while maintaining thermal contact with the liquid cooling system throughout the movement range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient heat dissipation with reduced cooling system size and power consumption, and minimizes damage from leaks by containing liquid within the chassis, enhancing the reliability of the cooling system.
Implementation Method 1
a computing device mounting element that is configured to mount to a computing device and to transfer heat generated by the computing device
Implementation Method 2
a multi-device chassis mounting element that includes a liquid cooling subsystem and that is configured to mount to a multi-device chassis, wherein the multi-device chassis mounting element is configured to: receive, from the computing device mounting element, the heat generated by the computing device and transferred by the computing device mounting element; and transfer the heat received from the computing device mounting element using the liquid cooling subsystem
Data Source
AI summary
A computing device liquid cooling system includes a multi-device chassis, a computing device, and a multi-device-chassis/device movable coupling liquid cooling system that moveably couples the computing device to the multi-device chassis. The multi-device-chassis/device movable coupling liquid cooling system includes a computing device mounting element that is mounted to the computing device and configured to transfer heat generated by the computing device, a multi-device chassis mounting element that includes a liquid cooling subsystem and that is mounted to the multi-device chassis, and a movable coupling that is configured to allow the computing device mounting element to move relative to the multi-device chassis mounting element. The multi-device chassis mounting element is configured to receive the heat generated by the computing device and transferred by the computing device mounting element, and transfer the heat received from the computing device mounting element using the liquid cooling subsystem.