Movable Cup Positioning in Substrate Processing to Limit Splash
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Solution Overview
Problem
In substrate processing apparatuses, a significant issue arises where minute droplets of chemical liquid splash from the inner wall surface of a cup unit, leading to contamination and deterioration of substrate quality due to adhesion of fine dust and chemical liquid, causing surface contamination and potential etching of the substrate.
Innovation Solution
A substrate processing apparatus is designed with a control unit that rotates the substrate and adjusts the position of a cup unit vertically to prevent droplets from colliding with adhering droplets on the cup's inner wall, using a first drive unit to rotate the substrate and a second drive unit to change the cup's position, ensuring that the chemical liquid treatment is executed while minimizing splash by moving the cup's receiving region in the vertical direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cup unit is kept stationary to simplify the device structure, then the device complexity is reduced, but splash occurs when droplets collide with adhering droplets on the cup inner wall, deteriorating substrate quality
Solution Approach 1:
The cup unit is made movable in the vertical direction by a second drive unit, allowing it to change position dynamically during substrate processing. This dynamic adjustment prevents droplets from colliding with adhering droplets on the cup inner wall, thereby preventing splash and maintaining substrate quality without requiring complex structural modifications
Solution Approach 2:
The vertical position parameter of the cup unit is changed during the chemical liquid treatment process. By adjusting the cup unit's position in the vertical direction, the system avoids collision between scattered droplets and adhering droplets, preventing splash while maintaining a relatively simple device structure
2Manufacturing precision
If the cup unit position is adjusted vertically during chemical liquid treatment, then splash is reduced and substrate quality is improved, but the device complexity increases due to the second drive unit
Solution Approach 1:
The cup unit is made movable in the vertical direction by a second drive unit, allowing it to change position dynamically during substrate processing. This dynamic adjustment prevents droplets from colliding with adhering droplets on the cup inner wall, thereby preventing splash and maintaining substrate quality without requiring complex structural modifications
Solution Approach 2:
The control unit controls the second drive unit to move the cup unit in the vertical direction periodically or at specific timing during the chemical liquid treatment process. This periodic position adjustment effectively prevents splash occurrence while keeping the device structure relatively simple
3Ease of manufacture
If droplets are allowed to collide with the cup inner wall to simplify liquid recovery, then the device structure is simplified, but minute droplets splash and adhere to the substrate, causing contamination
Solution Approach 1:
The cup unit is made movable in the vertical direction by a second drive unit, allowing it to change position dynamically during substrate processing. This dynamic adjustment prevents droplets from colliding with adhering droplets on the cup inner wall, thereby preventing splash and maintaining substrate quality without requiring complex structural modifications
Solution Approach 2:
The vertical position parameter of the cup unit is changed during the chemical liquid treatment process. By adjusting the cup unit's position in the vertical direction, the system avoids collision between scattered droplets and adhering droplets, preventing splash and substrate contamination while maintaining a relatively simple device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the likelihood of splash and contamination, enhancing substrate quality by preventing chemical liquid droplets from adhering to the substrate and maintaining a clean environment within the cup unit, thus improving the processing outcome.
Implementation Method 1
The first drive unit rotates the substrate holding unit about a virtual axis
Implementation Method 2
The second drive unit changes a relative position in the vertical direction of the cup unit with respect to the substrate holding unit
Implementation Method 3
The chemical liquid discharge portion discharges a chemical liquid toward the first surface of the substrate held by the substrate holding unit
Data Source
AI summary
In order to improve the quality of a substrate, a substrate processing apparatus includes a substrate holding unit, a first drive unit, a chemical liquid discharge portion, a cup unit, a second drive unit, and a control unit. The substrate holding unit holds a substrate having a first surface and a second surface opposite to the first surface in a horizontal posture. The first drive unit rotates the substrate holding unit about a virtual axis. The chemical liquid discharge portion discharges a chemical liquid toward the first surface of the substrate held by the substrate holding unit. The cup unit surrounds a periphery of the substrate holding unit. The second drive unit changes a relative position in the vertical direction of the cup unit with respect to the substrate holding unit. The control unit, while causing the first drive unit to rotate the substrate holding unit about the virtual axis and causing the chemical liquid discharge portion to discharge the chemical liquid toward the first surface of the substrate held by the substrate holding unit to execute a chemical liquid treatment of treating the first surface, causes the second drive unit to change the relative position in the vertical direction of the cup unit with respect to the substrate holding unit.