Movable Edge Nozzle Positioning for Substrate Bottom-Edge Cleaning
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Solution Overview
Problem
The photolithography process for semiconductor manufacturing faces challenges in uniformly cleaning the bottom edge of substrates due to interference issues with the edge nozzle, leading to incomplete removal of photoresist particles, which can cause errors in subsequent processing steps.
Innovation Solution
An apparatus with a substrate support member, a treating bowl, and an edge nozzle member that includes a main body, a nozzle arm, and a fixing member with a permanent magnet, allowing the nozzle arm to slidably move and be fixed at a precise position, enabling effective cleaning of the substrate's bottom edge without interference during bowl attachment or detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the bottom edge nozzle is positioned closely to the bottom edge part of the substrate to improve cleaning effectiveness, then the cleaning precision is improved, but the nozzle interferes with the bowl detachment process
Solution Approach 1:
The nozzle arm is designed to be movable rather than fixed, allowing it to change position dynamically. During cleaning operations, the nozzle arm extends to position the bottom edge nozzle closely to the substrate for effective cleaning. During bowl detachment, the nozzle arm retracts to avoid interference, enabling smooth operation of the bowl.
Solution Approach 2:
The nozzle system is divided into separate components: a main body mounted on the base plate, a movable nozzle arm, and the bottom edge nozzle. This segmentation allows independent movement of the nozzle arm while keeping the main body stationary, resolving the conflict between cleaning precision and bowl detachment ease.
2Ease of operation
If the nozzle arm is made movable to prevent interference during bowl handling, then the ease of operation is improved, but the positioning precision of the nozzle becomes difficult to maintain
Solution Approach 1:
The fixing member replaces complex mechanical positioning mechanisms with a simpler magnetic field-based system. The permanent magnet in the main body and the magnetic substrate in the nozzle arm create a magnetic attraction that automatically positions and holds the nozzle arm at the correct location, ensuring precision without complex mechanical structures.
Solution Approach 2:
The magnetic field acts as an intermediary between the main body and the nozzle arm, providing both positioning and fixing functions. This magnetic interaction enables precise positioning while allowing easy movement when needed, resolving the contradiction between stability and operability.
3Manufacturing precision
If a fixed nozzle position is used to ensure consistent cleaning quality, then the manufacturing precision is improved, but the nozzle cannot be retracted to avoid interference with bowl attachment or detachment
Solution Approach 1:
The nozzle arm transitions from a static fixed position to a dynamic movable position, allowing the system to adapt to different operational requirements. During cleaning, the nozzle arm maintains a stable position for consistent quality. During bowl attachment or detachment, the nozzle arm moves to avoid interference, providing the needed versatility.
Solution Approach 2:
The position parameter of the nozzle arm is changed dynamically based on the operational phase. When cleaning is required, the nozzle arm is positioned at a specific distance from the substrate for optimal cleaning. When bowl handling is required, the nozzle arm position is changed to avoid interference, allowing the same nozzle to serve multiple functions effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy cleaning of the substrate's bottom edge, prevents interference during bowl handling, and ensures precise positioning of the edge nozzle, enhancing the uniformity of the photolithography process and reducing errors.
Implementation Method 1
the fixing member may include a permanent magnet
Data Source
AI summary
An apparatus for performing heat treatment with respect to a substrate is provided. The apparatus for treating the substrate includes a substrate support member to seat a substrate on the substrate support member, a treating bowl to surround the substrate support member, a base plate provided to face a bottom surface of the substrate seated on the substrate support member, and an edge nozzle member mounted on the base plate to spray a treating liquid to a bottom edge part of the substrate seated on the substrate support member. The edge nozzle member includes a main body mounted on the base plate, a nozzle arm to mount an edge nozzle on the nozzle arm to slidably move on the main body, and a fixing member to maintain the nozzle arm at a setting position on the main body.