Movable Edge Ring Plasma Distribution Control

The patent applies the dynamics principle by making the edge ring movable instead of fixed. The edge ring can be positioned at different heights above the substrate support surface, allowing dynamic adjustment of plasma distribution. This movable structure enables control over electron density at substrate edge portions while maintaining a relatively simple overall device architecture, thus improving manufacturing precision without excessively increasing device complexity.

The patent implements parameter changes by adjusting the position of the edge ring relative to the substrate. By changing the height parameter of the edge ring, the plasma distribution characteristics and electron density at the substrate edge can be controlled. This parameter adjustment mechanism provides a straightforward method to improve plasma processing uniformity without requiring complex additional components.

The patent applies segmentation by separating the plasma distribution control function from the overall plasma processing conditions. The edge ring is specifically designed to control electron density at the substrate edge portion independently, while the central substrate area can be processed with optimized plasma conditions. This segmentation allows independent adjustment of edge region plasma characteristics without compromising the overall processing parameters, thereby maintaining degree of freedom while improving plasma distribution control.

The patent implements local quality by creating different plasma characteristics at different locations on the substrate. The edge ring specifically modifies the plasma environment at the substrate edge portion, generating a localized effect that differs from the central substrate area. This allows tailored plasma conditions for edge regions without altering the overall plasma processing parameters, preserving adaptability while achieving precise plasma distribution control.