Movable Fan Heat Dissipation System for Electronic Devices
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Solution Overview
Problem
Conventional external heat dissipation devices for electronic devices, such as notebook PCs, are not positioned close enough to heat-generating elements under the keyboard module, leading to inefficient heat dissipation and user discomfort due to heat radiation, which affects the device's operating efficiency.
Innovation Solution
A heat dissipation system comprising a heat dissipation body near the circuit board, equipped with thermal sensors and a movable fan controlled by a microcontroller, allowing the fan to move to areas of higher temperature for enhanced heat dissipation, thereby improving the proximity and efficiency of heat removal from heat-generating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If external heat dissipation device is disposed under the base of the electronic device, then the device structure is simple, but the heat dissipation efficiency is insufficient due to large distance from heat generating elements
Solution Approach 1:
The fan is designed to be movable rather than fixed, allowing it to dynamically reposition itself based on real-time temperature feedback from multiple thermal sensors. This dynamic positioning capability enables the heat dissipation system to adapt to varying thermal conditions and target specific high-temperature areas, thereby improving heat dissipation efficiency without complicating the overall device structure
Solution Approach 2:
The heat dissipation system employs thermal sensors distributed across the heat dissipation body to autonomously detect temperature distribution, and the control unit automatically adjusts fan positioning based on this feedback. This self-regulating mechanism eliminates the need for complex external control systems while optimizing heat dissipation performance
2Reliability
If heat dissipation body is positioned closer to circuit board, then heat dissipation efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The heat dissipation body is segmented into multiple areas with distributed thermal sensors, allowing independent temperature monitoring and targeted cooling. The fan can be positioned to serve specific segments based on thermal needs, improving efficiency without requiring a completely redesigned complex structure
Solution Approach 2:
The movable fan mechanism serves multiple functions: it can be positioned to cool different areas of the circuit board, adapt to varying thermal loads, and respond to changing operational conditions. This multi-functionality justifies the increased structural complexity by providing superior heat dissipation performance across diverse scenarios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively improves heat dissipation efficiency by positioning the heat dissipation body closer to the circuit board, reducing overheating issues and enhancing the operating performance of electronic devices.
Implementation Method 1
The plurality of first thermal sensors is distributed in various areas of the heat dissipation body and used for monitoring a working temperature of each area
Implementation Method 2
The at least one movable fan is movably disposed on the heat dissipation body and electrically coupled with the control unit, thereby allowing the control unit to control the movable fan to move to an area of the heat dissipation body having a higher working temperature
Data Source
AI summary
A heat dissipation system and an electronic device using the heat dissipation system are disclosed. The electronic device comprises a device main body including a circuit board. The heat dissipation system comprises a heat dissipation body, a control unit and a movable fan. The heat dissipation body is disposed near the circuit board. A plurality of first thermal sensors is distributed in various areas of the heat dissipation body and is used for monitoring a working temperature of each area. The control unit is electrically coupled with each thermal sensor. The movable fan is movably disposed at the heat dissipation body and is electrically coupled with the control unit to receive a signal, thereby allowing the control unit to control the movable fan to move to an area of the heat dissipation body having a higher working temperature than those of the other areas.