Movable Fin Heat Sink for Electronic Components
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Solution Overview
Problem
Conventional fin-type heat sinks for electronic components face challenges in efficiently dissipating heat and facilitating easy assembly and detachment, particularly in narrow spaces, as they do not effectively adapt to maximize heat dissipation efficiency during component usage.
Innovation Solution
A fin-type heat sink design where fins are moveable between a laid position for assembly and an erected position for enhanced heat dissipation, utilizing a confining member such as a pressure support, hinge portion, or elastic portion to transition between these positions, allowing for efficient heat dissipation and compact assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fins are kept in an erected position for maximum heat dissipation, then heat dissipation efficiency is improved, but assembly and detachment of electronic components becomes difficult in narrow spaces
Solution Approach 1:
The fin structure is designed to be dynamically changeable between two states: an erected position for maximum heat dissipation and a laid position for easy assembly and detachment. The confining member enables this dynamic transformation, allowing the heat sink to adapt its configuration based on operational requirements.
Solution Approach 2:
The heat sink is segmented into the main body, movable fins, and a confining member. This segmentation allows the fins to be independently positioned relative to the main body, enabling them to be laid flat during assembly and erected during operation, thus resolving the contradiction between assembly ease and heat dissipation efficiency.
2Ease of operation
If fins are laid flat to facilitate assembly in narrow spaces, then ease of assembly is improved, but heat dissipation surface area is reduced
Solution Approach 1:
The fin structure transitions from a static to a dynamic design, allowing it to change configuration. During assembly, fins are laid flat to access narrow spaces, and after assembly, they are erected to maximize heat dissipation surface area, thus resolving the contradiction between assembly ease and heat dissipation efficiency.
Solution Approach 2:
The confining member is designed to hold the fins in a laid position during the assembly process (preliminary state), and then release or transform to allow the fins to be erected into their operational position, enabling easy assembly without permanently compromising heat dissipation capability.
3Device complexity
If a fixed fin structure is used for simplicity, then device complexity is reduced, but adaptability to different operational states is lost
Solution Approach 1:
The heat sink incorporates a dynamic element (movable fins with confining member) that allows transformation between assembly and operational states. This dynamic design provides adaptability while maintaining relatively simple construction through the use of elastic portions or hinge mechanisms.
Solution Approach 2:
The fin configuration changes its physical state (from laid to erected) by altering its geometric parameters. The confining member, through elastic deformation or hinge rotation, enables this parameter change, providing adaptability without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables efficient heat dissipation by maximizing the surface area of fins after assembly, while allowing for easy assembly and detachment, thus meeting heat dissipation specifications and minimizing product volume.
Implementation Method 1
a fin-type heat sink according to still another exemplary embodiment of the present invention; FIG. 13 is a magnified cross-sectional view of another exemplary embodiment of a fin-type heat sink; a fin-type heat sink according to an exemplary embodiment of the present invention, in which fins are laid; FIG. 16 is a cross-sectional view of the fin-type heat sink shown in FIG. 15, in which the fins are erected
Implementation Method 2
a fin-type heat sink according to an exemplary embodiment of the present invention, in which fins are laid; FIG. 3 is a cross-sectional view of the fin-type heat sink shown in FIG. 1, in which fins are erected; FIG. 4 is a magnified cross-sectional view of a bent portion of a fin shown in FIG. 3
Implementation Method 3
The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body
Implementation Method 4
The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body
Data Source
AI summary
One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.