Movable Fin Support Heat Sink for Motherboard Access
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Solution Overview
Problem
Heat sinks for electronic components often obstruct access to electrical contacts on motherboards due to overhanging portions, making it difficult to test components during operation.
Innovation Solution
A heat sink design featuring a thermally conductive base and a pivotable fin support that can be moved between obstructing and non-obstructing positions, allowing access to electrical contacts while maintaining efficient heat dissipation through a plurality of fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the fin support extends beyond the base to form an overhanging portion, then the heat dissipation capacity is improved, but the access to electrical contacts on the motherboard is obstructed
Solution Approach 1:
The fin support is made movable relative to the base through a pivot member, allowing it to transition between a first position where it obstructs access to electrical contacts and a second position where it provides clear access. This dynamic configuration enables the heat sink to adapt its structure based on operational requirements.
2Ease of operation
If the fin support is made movable to allow access to contacts, then the ease of operation is improved, but the structural stability is reduced
Solution Approach 1:
The pivot member enables controlled movement of the fin support while maintaining structural integrity. The fin support can be positioned in different configurations (obstructing or non-obstructing) and remains stable in each position during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates testing of electronic components by providing access to obstructed contacts while maintaining effective heat transfer capabilities, ensuring efficient heat removal from heat-generating devices.
Implementation Method 1
a base of a heat sink... conducting heat from the heat-generating electronic device through the base to the fin support
Implementation Method 2
dissipating heat from the fin support through the plurality of fins
Data Source
AI summary
A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.