Movable Fixing Sets for Heat Dissipation Device Substrates
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Solution Overview
Problem
The existing fixing structures for heat dissipation devices require multiple configurations to accommodate various electronic components, leading to complexity and inefficiency due to the varying locations and arrangements of fixing holes on substrates.
Innovation Solution
A fixing structure with a plate portion and movable fixing sets that include grooves and screw components, allowing the fixing sets to align with multiple fixing holes, enabling adaptation to different substrates and electronic components without the need for multiple fixing frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple fixing frames with different through hole arrangements are used to accommodate various fixing hole arrangements on substrates, then the adaptability to different substrates and electronic components is improved, but the device complexity increases
Solution Approach 1:
The fixing frame is designed with a single standardized arrangement of through holes that can accommodate multiple different fixing hole arrangements on substrates. The fixing set includes a plate portion with grooves and a fixing component that can be positioned at different locations, allowing one fixing frame to serve multiple substrate configurations universally
Solution Approach 2:
The fixing set is designed to be movable within the plate portion, allowing the fixing component to be repositioned along the grooves to align with different fixing hole arrangements on the substrate. This dynamic adjustment capability enables a single fixing frame to adapt to various electronic component types and sizes
2Adaptability or versatility
If multiple fixing frames with different through hole arrangements are used to correspond to various electronic components, then the compatibility with diverse electronic components is improved, but the quantity of fixing frames needed increases
Solution Approach 1:
One standardized fixing frame design can be used for all electronic components by combining it with the adjustable fixing set. The fixing set's ability to move and reposition allows a single fixing frame to replace multiple specialized fixing frames that would otherwise be needed for different component types
Solution Approach 2:
The invention merges the functions of multiple specialized fixing frames into a single universal fixing frame by integrating the adjustable fixing set with the plate portion. This consolidation reduces the total quantity of fixing frames from multiple specialized designs to one standardized design
3Manufacturing precision
If a fixed fixing frame with specific through hole arrangements is used, then the manufacturing precision is improved, but the adaptability to various fixing hole arrangements deteriorates
Solution Approach 1:
The fixing set is designed with movable components that can be repositioned along grooves in the plate portion, allowing alignment with different fixing hole arrangements on substrates. This dynamic adjustability maintains manufacturing precision while adapting to various electronic component configurations
Solution Approach 2:
The fixing set is divided into separable components including the plate portion with grooves and the movable fixing component. This segmentation allows the fixing component to be independently positioned and adjusted to match different fixing hole arrangements while maintaining precise manufacturing tolerances
Data Source
AI summary
A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.