Movable Process-Fluid Distribution Body for Uniform Large-Substrate Plating
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Solution Overview
Problem
Existing High Speed Plating (HSP) systems are limited in size by manufacturability, restricting the treatment of substrates beyond G6 technology generations, necessitating a solution for uniform electroplating on larger substrates.
Innovation Solution
A distribution system comprising a movable distribution body and substrate holder, with the distribution body having openings for process fluid and electric current, allowing relative movement to cover the entire substrate surface uniformly, and including features like jet holes and drain holes for fluid control, and optionally an anode, to achieve uniform current density distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If HSP systems are scaled up to treat larger substrates, then substrate treatment area is increased, but system complexity and manufacturing costs increase significantly
Solution Approach 1:
The distribution body is divided into multiple segments or modules, each capable of independently distributing process fluid to specific zones of the substrate. This modular approach allows the system to handle larger substrate areas without proportionally increasing overall system complexity, as each module can be standardized and replicated.
Solution Approach 2:
The distribution body is designed to be movable relative to the substrate holder, enabling dynamic adjustment of the distribution area and position. This allows a single distribution body of manageable size to treat progressively larger substrate areas through movement, avoiding the need to scale up the entire distribution system simultaneously.
2Area of stationary object
If HSP systems are scaled up to treat larger substrates, then substrate treatment area is increased, but manufacturing costs increase
Solution Approach 1:
The distribution body is divided into multiple segments or modules, each capable of independently distributing process fluid to specific zones of the substrate. This modular approach allows the system to handle larger substrate areas without proportionally increasing overall system complexity, as each module can be standardized and replicated.
Solution Approach 2:
The distribution body is designed to be movable relative to the substrate holder, enabling dynamic adjustment of the distribution area and position. This allows a single distribution body of manageable size to treat progressively larger substrate areas through movement, avoiding the need to scale up the entire distribution system simultaneously.
3Manufacturing precision
If a distribution body covers the entire substrate area, then uniform treatment is achieved, but the distribution body size becomes excessively large and complex
Solution Approach 1:
The distribution body is designed to be movable relative to the substrate holder, enabling dynamic adjustment of the distribution area and position. This allows a compact distribution body to achieve complete substrate coverage through progressive scanning movements, maintaining uniform treatment without requiring an excessively large structure.
Solution Approach 2:
The distribution body performs periodic scanning movements across the substrate surface, delivering process fluid in a systematic sequence of positions. This periodic action ensures uniform treatment coverage while allowing the distribution body to remain compact in size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uniform treatment of substrates up to G6 and beyond, improving manufacturing efficiency and reducing complexity and costs by allowing larger substrates to be treated with high uniformity and throughput.
Implementation Method 1
At least some of the several openings of the distribution body may be configured to direct the process fluid to the surface of the substrate to be treated while providing a highly uniform current density distribution over the covered predefined processing area
Implementation Method 2
The movement of the distribution body and the substrate holder may be a linear movement along the length of the substrate holder. This may provide a complete coverage of the substrate holder surface while providing an even treatment throughout the substrate.
Data Source
AI summary
The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length (l) and a distribution body width (w), and wherein the distribution body length (l) is smaller than the substrate holder length (L).