Movable Foot Structure for Heat Dissipation in Hinged Electronic Devices
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Solution Overview
Problem
Electronic devices, such as laptops, face challenges in heat dissipation due to compact designs and integrated components, which can limit air flow and increase internal temperatures.
Innovation Solution
The electronic device incorporates a hinge module with a gear assembly and a foot structure that adjusts its height based on the angle between the device's housings, allowing for increased air flow and reduced heat transfer from the ground, thereby enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the electronic device uses a compact design with integrated components, then portability and convenience are improved, but heat dissipation capability deteriorates due to limited air flow
Solution Approach 1:
The foot structure is designed to be movable rather than fixed, allowing it to adjust its height and position dynamically. The movable foot structure can extend to increase the distance between the device and the support surface, thereby improving air flow and heat dissipation when needed, while retracting when portability is the priority.
Solution Approach 2:
The foot structure adds a vertical dimension adjustment capability to the compact device. By extending the foot structure upward, the device creates additional space for air circulation beneath it, effectively using the vertical dimension to improve heat dissipation without increasing the device's horizontal footprint.
2Productivity
If the electronic device uses a compact design, then integration density is improved, but air flow for heat dissipation deteriorates
Solution Approach 1:
The foot structure provides dynamic adjustment capability, allowing the device to optimize its configuration based on operational needs. During high-performance tasks requiring better heat dissipation, the foot structure can be extended to increase air flow, while during portability-focused scenarios, it can be retracted to maintain compact dimensions.
Solution Approach 2:
The foot structure enables change in the physical parameter of distance between the device and the support surface. By adjusting this parameter, the device can optimize air flow characteristics and heat dissipation efficiency without compromising its compact integrated design.
3Temperature
If the distance between the electronic device and the ground is increased using an ergo lift hinge, then heat dissipation is improved, but the rotation angle between body part and display part is limited
Solution Approach 1:
The support adjustment function is segmented into two independent systems: the ergo lift hinge for vertical distance adjustment and the foot structure with gear assembly for angle adjustment. This segmentation allows each subsystem to optimize its specific function without constraining the other, enabling both improved heat dissipation and full 360-degree rotation capability.
Solution Approach 2:
The foot structure acts as an intermediary element between the device body and the support surface. By providing adjustable support through the cam structure and gear assembly, it enables the ergo lift hinge to achieve optimal lifting distance while maintaining full rotation flexibility through the decoupled angular adjustment mechanism.
4Temperature
If the foot structure is made movable to adjust height, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The foot structure integrates multiple functions into a single mechanism: support height adjustment through cam structure interaction with the rack gear, angular position adjustment through the gear assembly, and locking/unlocking capabilities. By merging these functions into one integrated component, the design achieves improved heat dissipation without proportionally increasing overall device complexity.
Solution Approach 2:
The foot structure serves multiple purposes: it provides adjustable height for heat dissipation optimization, enables angular adjustment for different usage scenarios, and can be integrated with the hinge mechanism for coordinated movement. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Data Source
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AI summary
Provided is an electronic device. The electronic device comprises: a housing assembly comprising a first housing and a second housing configured to rotate relative to the first housing; a hinge module connected to the first housing and the second housing and including a rotation gear; a gear assembly comprising a pinion gear rotatably connected to the rotation gear, a rack gear configured to slide in a first axis direction on the basis of the rotation of the pinion gear, and a cam structure connected to the rack gear; and a foot structure which is connected to the first housing, is movable in a second axis direction perpendicular to the first axis direction on the basis of the first movement of the cam structure, and is configured to move in a third axis direction that is perpendicular to the first axis direction on the basis of the second movement of the cam structure.