Movable Heat Conducting Assembly for Passive Thermal Dissipation
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Solution Overview
Problem
Conventional electronic devices rely on fans for heat dissipation, which consume electricity, generate noise, and require maintenance, failing to address the need for an efficient and low-maintenance heat dissipation solution.
Innovation Solution
An electronic device with a heat dissipating module featuring a movable heat conducting assembly, where a second heat conducting portion is connected to the heat generating component and can move toward the outer case, applying force through resilient deformation to enhance heat transfer without the need for fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is used to dissipate heat, then heat dissipation is achieved, but electricity is consumed and noise is generated
Solution Approach 1:
The patent replaces the mechanical fan system with a passive thermal conduction system. The heat conducting assembly uses direct thermal contact between the heat generating component and the outer case to transfer heat, eliminating the need for mechanical motion and electrical power consumption while maintaining effective heat dissipation.
Solution Approach 2:
The heat conducting assembly operates autonomously without requiring external power or control systems. The resilient component automatically maintains contact pressure between the heat conducting portion and the heat generating component, allowing the system to self-regulate and maintain thermal contact without external intervention.
2Temperature
If a fan is used to dissipate heat, then heat dissipation is achieved, but noise is generated
Solution Approach 1:
The patent eliminates the mechanical fan system that generates noise by replacing it with a passive thermal conduction mechanism. The heat conducting assembly transfers heat through direct contact without mechanical motion, thereby eliminating noise generation while maintaining heat dissipation functionality.
3Temperature
If a fan is used to dissipate heat, then heat dissipation is achieved, but regular maintenance is required
Solution Approach 1:
The patent replaces the mechanical fan system that requires regular maintenance with a passive thermal conduction system. The heat conducting assembly with resilient component has no moving parts, eliminating the need for maintenance while ensuring continuous heat dissipation operation.
Solution Approach 2:
The resilient component automatically maintains thermal contact through its elastic properties, allowing the system to self-maintain without external intervention or regular maintenance, unlike mechanical fans that require periodic servicing.
4Temperature
If a movable heat conducting portion is used, then heat transfer is enhanced, but device complexity increases
Solution Approach 1:
The patent incorporates a movable heat conducting portion that can dynamically adjust its position and contact pressure with the heat generating component. This dynamic capability allows the system to adapt to thermal expansion, contraction, and misalignment, enhancing heat transfer efficiency while the movable design itself remains relatively simple.
Solution Approach 2:
The resilient component allows the heat conducting portion to change its physical state and contact pressure in response to thermal conditions. This parameter change capability enables the system to maintain optimal thermal contact under varying operating conditions without requiring complex control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves enhanced heat dissipating efficiency with low power consumption, reduced noise, and lower maintenance costs, while simplifying the assembly process by eliminating fan-related issues and tolerance accumulation.
Implementation Method 1
The second heat conducting portion is connected to the first heat conducting portion and for abutting against the heat generating component... conduct heat generated by the heat generating component to the at least one first heat conducting component
Implementation Method 2
The heat conducting assembly is resiliently deformed to apply a force on the heat generating component... the at least one first heat conducting component and the at least one resilient component are resiliently deformed to apply the force on the heat generating component
Data Source
AI summary
An electronic device includes an outer case, a heat generating component and a heat dissipating module. The heat generating component is disposed inside the outer case. The heat dissipating module is located between the outer case and the heat generating component and includes a heat conducting assembly including a first heat conducting portion fixed on the outer case and connected to the outer case and a second heat conducting portion connected to the first heat conducting portion and for abutting against the heat generating component. The second heat conducting portion is movable relative to the outer case for moving toward or away from the outer case. The heat conducting assembly is resiliently deformed to apply a force on the heat generating component in a contacting manner when the heat generating component pushes the second heat conducting portion of the heat conducting assembly to move toward the outer case.