Movable Heat Sink for Semiconductor Diagnostic Chip Thermal Cycling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for thermal cycling of fluid samples are inefficient and not well-suited for use with semiconductor diagnostic chips, particularly in sample preparation systems, due to complex assemblies, time-consuming processes, and incompatibility with existing sample processing technologies.
Innovation Solution
The development of thermal control units that facilitate cooling by thermal conduction using a slug of thermally conductive metal, or by using a flexible thermally conductive material and an inflatable bladder, or a moveable heat sink, to improve the integration and efficiency of thermal cycling with semiconductor diagnostic chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional thermal cycling methods are used with semiconductor diagnostic chips, then thermal cycling can be performed, but the process is time-consuming and inefficient
Solution Approach 1:
The patent employs a movable heat sink that can dynamically contact and disconnect from the semiconductor chip surface. During cooling phases, the heat sink contacts the chip to rapidly conduct heat away. During heating phases, it disconnects to allow rapid heating. This dynamic positioning enables fast thermal cycling by optimizing heat transfer conditions at each phase of the cycle.
Solution Approach 2:
The patent extracts the heat sink function from a continuous thermal coupling system and implements it as a separate, movable component that can be selectively applied to the chip surface. This allows the thermal cycling system to switch between rapid cooling (when heat sink contacts) and rapid heating (when heat sink disconnects), significantly reducing cycle times compared to conventional continuous thermal coupling methods.
2Reliability
If complex assemblies are used for thermal cycling, then temperature control can be achieved, but device complexity increases
Solution Approach 1:
The movable heat sink is designed to be self-actuating through thermal expansion mechanisms or simple mechanical biases that automatically position the heat sink for optimal thermal contact during cooling phases and allow disconnection during heating phases. This self-service approach eliminates the need for complex external control systems, motors, or sensors while maintaining precise temperature control.
Solution Approach 2:
The patent introduces a simple mechanical intermediary structure (the movable heat sink assembly) that mediates between the thermal cycling requirements and the semiconductor chip. This intermediary provides the necessary thermal coupling during cooling while allowing decoupling during heating, achieving precise temperature control through a relatively simple mechanical design rather than complex active control systems.
3Adaptability or versatility
If conventional chip packaging and fluidic transport means are used, then semiconductor chips can be utilized, but the system becomes incompatible with existing sample processing technologies
Solution Approach 1:
The movable heat sink design is implemented as a universal thermal control mechanism that can be integrated with various semiconductor chip packages and fluidic transport systems. The heat sink's movable contact mechanism provides a standardized interface for thermal cycling that adapts to different chip configurations and sample processing technologies, enabling broad compatibility without requiring complex custom integration for each application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These thermal control units enhance the efficiency of thermal cycling, reduce costs, and enable seamless integration with existing sample preparation technologies, allowing for rapid and precise temperature control necessary for accurate PCR testing.
Implementation Method 1
facilitates cooling by thermal conduction utilizing a slug of thermally conductive metal
Implementation Method 2
using a flexible thermally conductive material and an inflatable bladder
Implementation Method 3
or a moveable heat sink, to improve the integration and efficiency of thermal cycling
Data Source
AI summary
Thermal control devices utilizing a thermal switch to facilitate cooling of a biological sample, particularly a biological sample tested with a semiconductor diagnostic detection chip. Such thermal switches can include a mass of thermally conductive material, such as copper or aluminum, that selectively contacts the diagnostic chip or sample tube by use of an air cylinder or a servo-driven moveable support. Alternatively, the thermal switch can utilize a thermally conductive material that selectively contacts the diagnostic chip or sample tube by use of an inflatable bladder. Alternatively, the thermal switch can utilize a voice coil and a heat sink to selectively contact the diagnostic chip. The thermal control device can further include thermal overshoot feature, such as an air blower or placement of a heat sink in close proximity to the chip or tube. Associated methods of assembly and use of thermal control devices are also provided herein.