Movable Heat Sink Assembly for Pluggable Modules
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Solution Overview
Problem
Existing heat sink assemblies for pluggable modules are cumbersome to assemble and manufacture, and their integration with modular electronic devices leads to inefficient thermal connections, as they can damage thermal interface materials when modules are inserted or removed, making them less effective in high-volume manufacturing and maintenance scenarios.
Innovation Solution
A heat sink assembly with a movable base frame and transfer links that allow the heat sink to be elevated or recessed, maintaining thermal communication with the pluggable module, and an actuator assembly for user-activated movement, ensuring efficient thermal contact without damaging the thermal interface material during module insertion and removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat sink is integral with the pluggable module, then thermal connection is maintained, but handling efficiency in high-volume manufacturing is reduced
Solution Approach 1:
The heat sink is divided into two independent parts: one attached to the pluggable module and another fixed to the receptacle. These segmented components can be handled separately during manufacturing and assembly, improving productivity while maintaining thermal connection when engaged.
Solution Approach 2:
The heat sink is extracted from the integral design and made into a separate, movable component that can be engaged or disengaged independently from the pluggable module, allowing efficient handling while preserving thermal contact when needed.
2Reliability
If the pluggable module slides along the thermal interface material, then thermal contact is maintained, but the thermal interface material is damaged or destroyed
Solution Approach 1:
The heat sink is designed with dynamic capability to be elevated or lowered relative to the pluggable module. During insertion/removal, it can be elevated to prevent sliding contact with the thermal interface material, protecting it from damage while maintaining thermal contact when in the engaged position.
3Device complexity
If the heat sink is fixed to the receptacle, then thermal management is simplified, but the heat sink cannot be disengaged during module insertion and removal
Solution Approach 1:
The heat sink incorporates movable components that allow it to be dynamically positioned between engaged and disengaged states. Transfer links enable the heat sink to move relative to both the receptacle and pluggable module, providing adaptability while maintaining relatively simple thermal management architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reusable heat sink assembly that maintains efficient thermal contact with pluggable modules during insertion and removal, preventing damage to the thermal interface material and enhancing the thermal management of high-power modules in modular electronic devices.
Implementation Method 1
a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module
Data Source
AI summary
A heat sink assembly includes a base frame and a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module. The heat sink assembly also includes transfer links extending between the heat sink and the base frame. The transfer links are movable to transfer the heat sink with respect to the base frame. The heat sink is movable between a recessed position and an elevated position, wherein the transfer links maintain the heat sink in a predetermined orientation with respect to the engagement surface of the pluggable module as the heat sink is transferred, between the recessed position and the elevated position.