Movable Heater Substrate Processing Temperature Control

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Solution Overview

Problem

Existing selective epitaxy processes face challenges in maintaining selectivity and controlling temperature, leading to uncontrolled nitridation and thermal issues due to high reaction temperatures, which affect the deposition of polycrystalline and epitaxial materials on substrates.

Innovation Solution

A substrate processing apparatus with a lift module that adjusts the distance between a heater and a heating plate, allowing for precise control of substrate temperature by varying the heat transfer amount, enabling efficient adjustment of heating temperatures without contamination or prolonged process times.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high reaction temperature (about 800°C or more) is used for selective epitaxy process, then deposition reaction rate is improved, but uncontrolled nitridation reaction and thermal damage occur on the substrate surface

Engineering Contradiction:
Improvedeposition reaction rateVSAvoidnitridation reaction and thermal damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The heater is designed to be movable relative to the substrate, allowing the heating temperature to be dynamically adjusted during the deposition process. The heater can be raised to decrease heating temperature or lowered to increase heating temperature, enabling real-time control of the thermal environment to prevent nitridation and thermal damage while maintaining deposition efficiency

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention changes the temperature parameter dynamically during the deposition process by adjusting the heater position. This allows the system to operate at different temperatures at different stages of the process, achieving high deposition rates when needed while preventing harmful thermal effects

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If heater is fixedly disposed close to heating plate, then heating efficiency is improved, but temperature control precision deteriorates due to inability to adjust heat transfer amount

Engineering Contradiction:
Improveheating efficiencyVSAvoidtemperature control precision
Core Design Contradiction:
Use of energy by moving objectVSMeasurement precision

Solution Approach 1:

The heater is made movable relative to the heating plate, allowing dynamic adjustment of the distance between them. This enables precise control of heat transfer amount by varying the heater position, achieving both high heating efficiency when close and precise temperature control when at adjustable distances

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for precise temperature control during selective epitaxy processes, reducing thermal issues and maintaining selectivity, thus improving the deposition of polycrystalline and epitaxial materials on substrates while minimizing contamination and process delays.

Implementation Method 1

a heater spaced from a lower portion of the heating plate to heat the heating plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9644895B2Heater moving type substrate processing apparatus
Publication Date: 2017.05.09 EUGENE TECH CO LTD
  • US9644895B2 patent drawing
  • US9644895B2 patent drawing
  • US9644895B2 patent drawing

AI summary

Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber providing an inner space in which a process with respect to a substrate is performed, a heating plate on which the substrate is placed, the heating plate being fixedly disposed within the chamber, a heater spaced from a lower portion of the heating plate to heat the heating plate, and a lift module lifting the heater.