Movable Heating Mechanism for Substrate Processing Temperature Uniformity

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in achieving uniform temperature distribution and reducing power consumption while accommodating multiple substrates, as they often rely on inefficient heating mechanisms that dissipate heat and require complex gas supply systems.

Innovation Solution

A substrate processing apparatus with a movable heating mechanism that includes a supply heating mechanism covering regions with gas supply pipes and an exhaust heating mechanism covering regions without pipes, featuring insertion holes for pipe passage and slide rails for horizontal movement, allowing for improved temperature uniformity and reduced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heating mechanism covers the entire side wall of the processing container, then temperature uniformity is improved, but heat dissipation to the outside increases and power consumption rises

Engineering Contradiction:

Improvetemperature uniformityVSAvoidheat dissipation

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The heating mechanism is divided into multiple independent heating units that can be selectively positioned. Each heating unit can be independently controlled and positioned at different locations around the processing container, allowing heat to be applied only where needed rather than uniformly across the entire side wall.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heating units are made movable along the side wall of the processing container, enabling dynamic repositioning. This allows the heating mechanism to adapt its configuration based on the presence of pipes or other components, optimizing heat distribution while minimizing heat dissipation to the environment.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If gas supply pipes are provided on the side wall of the processing container, then gas supply functionality is improved, but temperature uniformity deteriorates due to interruptions in the heating coverage

Engineering Contradiction:

Improvegas supply functionalityVSAvoidtemperature uniformity

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The heating units can move dynamically to reposition around pipes, maintaining continuous heating coverage even in the presence of pipes. This dynamic repositioning capability allows the system to accommodate gas supply infrastructure without compromising temperature uniformity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The heating mechanism provides localized heating control, allowing different regions of the processing container side wall to receive appropriate heating. This enables the system to maintain temperature uniformity in areas not interrupted by pipes while accommodating gas supply functionality where needed.

Inventive Principle:

Principle #3Local quality

3Device complexity

If a fixed heating mechanism is used, then structural simplicity is improved, but adaptability to different pipe configurations deteriorates

Engineering Contradiction:

Improvestructural simplicityVSAvoidadaptability to pipe configurations

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The heating units are designed to be movable rather than fixed, allowing them to be repositioned according to different pipe configurations. This dynamic capability provides adaptability to various layouts while maintaining relatively simple structural design through modular heating units.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The movable heating units serve multiple functions: they can accommodate different pipe configurations, maintain temperature uniformity, and reduce heat dissipation. This multi-functionality provides versatility without significantly increasing structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances in-plane and between-substrate temperature uniformity while reducing power consumption by optimizing the heating mechanism's layout and pipe placement, allowing for more efficient gas supply and exhaust systems.

Implementation Method 1

a heating mechanism provided around the processing container

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

a first heating mechanism configured to cover a first region of the side wall of the processing container where the pipe is provided

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240376603A1Substrate processing apparatus

Publication Date: 2024.11.14 TOKYO ELECTRON LTD

AI summary

A substrate processing apparatus, includes a processing container capable of accommodating a substrate holder configured to hold substrates; a pipe extending in a horizontal direction from a side wall of the processing container; and a heating mechanism provided around the processing container. The heating mechanism includes a first heating mechanism configured to cover a first region of the side wall of the processing container where the pipe is provided, and a second heating mechanism configured to cover a second region of the side wall of the processing container excluding the first region. The first heating mechanism has a first insertion hole through which the pipe is inserted, and the first heating mechanism is movable in the horizontal direction between a position where the pipe passes through the first insertion hole and a position where the pipe does not pass through the first insertion hole.