Movable Heatsink Insert With Thermal Fluid For PCB Protection
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Solution Overview
Problem
The challenge in information handling systems is the difficulty in achieving precise z-placement of heatsinks on electrical components, leading to inadequate thermal contact and potential damage to printed circuit boards due to manufacturing tolerances, which results in inefficient heat dissipation and overheating.
Innovation Solution
The implementation of a movable heatsink insert, thermally coupled to the electrical component and the main heatsink, using a thermal fluid to facilitate heat transfer along the z-dimension from the electrical component to the heatsink, reducing the need for precise z-placement and minimizing the risk of PCB bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is placed directly on the electrical component to improve thermal contact, then heat dissipation efficiency is improved, but manufacturing precision requirements increase and risk of PCB bending increases
Solution Approach 1:
The patent introduces a thermal pad as an intermediary component between the heatsink and the electrical component (CPU). This thermal pad compensates for z-dimension placement variations, ensuring consistent thermal contact without requiring high manufacturing precision. The thermal pad acts as a mediator that absorbs dimensional tolerances while maintaining effective heat transfer from the CPU to the heatsink.
2Manufacturing precision
If a thick thermal pad is used to compensate for z-placement variations, then manufacturing precision requirements are reduced, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent changes the physical state and properties of the thermal interface material by using a fluid-filled cavity instead of a solid thermal pad. The fluid (thermal conductor) provides superior thermal conductivity compared to conventional solid thermal pads, enabling effective heat transfer even with larger z-dimension tolerances. This parameter change from solid to fluid state allows for greater manufacturing flexibility while maintaining or improving thermal performance.
3Temperature
If the heatsink is forced down to ensure thermal contact, then heat transfer efficiency is improved, but the PCB may bend or break
Solution Approach 1:
The patent uses a compliant thermal pad as an intermediary that absorbs the mechanical stress between the heatsink and the PCB. Instead of forcing the rigid heatsink directly onto the PCB, the thermal pad deforms to accommodate placement variations, eliminating the need for excessive clamping force that would bend or break the PCB. This mediator protects the PCB structural integrity while ensuring adequate thermal contact.
4Ease of manufacture
If a conventional solid thermal pad is used, then ease of manufacture is improved, but thermal resistance is high and device size must be larger
Solution Approach 1:
The patent changes the thermal interface material from solid to fluid state, creating a liquid-filled cavity between the heatsink and electrical component. This fluid thermal conductor provides superior thermal conductivity compared to solid thermal pads, reducing thermal resistance significantly. The fluid can flow to fill gaps and conform to surface irregularities, improving thermal contact efficiency without requiring larger device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the operating temperature of electrical components, enhancing the efficiency and reliability of information handling systems by allowing for improved thermal performance without compromising the integrity of the printed circuit board.
Implementation Method 1
a thermal fluid to facilitate heat transfer along the z-dimension from the electrical component to the heatsink
Data Source
AI summary
Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.