Movable Mask Gap Control in Sputtering Apparatus
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Solution Overview
Problem
Conventional in-line sputtering apparatuses face challenges in maintaining a uniform gap between the substrate and mask, leading to particle contamination and back sputtering issues due to thermal deformation and large gaps, which can result in substrate damage and contamination.
Innovation Solution
The implementation of a sputtering apparatus with a carrier and multiple movable masks along its sides, allowing for individual adjustment of mask positions based on the carrier's bending degree to maintain a consistent gap and prevent contamination, utilizing a system with floating masks and moving units to minimize gaps and stabilize plasma generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a fixed mask is used in an in-line sputtering apparatus, then the structure is simple, but the gap between mask and substrate cannot be maintained uniformly due to carrier bending, causing particle contamination and back sputtering
Solution Approach 1:
The mask is changed from a fixed structure to a movable structure that can dynamically adjust its position. The mask includes a mask body that can move along the traveling direction of the carrier, allowing it to adapt to carrier bending and maintain a uniform gap during the sputtering process.
Solution Approach 2:
A feedback mechanism is introduced where the position of the mask is adjusted based on the actual gap measurement. The mask position controller receives information about the gap between the mask and substrate, and automatically adjusts the mask position to maintain the desired uniform gap, preventing particle contamination and back sputtering.
2Object-affected harmful factors
If the gap between mask and substrate is reduced to prevent back sputtering, then particle contamination is reduced, but the risk of substrate-mask contact and substrate damage increases
Solution Approach 1:
The mask position is made dynamic rather than fixed, allowing continuous adjustment during the sputtering process. This enables the system to maintain an optimal gap that prevents back sputtering and particle contamination while avoiding contact with the substrate, even when carrier bending occurs.
Solution Approach 2:
A feedback control system monitors the gap between the mask and substrate in real-time and adjusts the mask position accordingly. This ensures the gap remains within a safe range that prevents both particle contamination from back sputtering and substrate damage from contact.
3Manufacturing precision
If multiple movable masks are added to maintain uniform gap, then gap uniformity and plasma stability improve, but device complexity increases
Solution Approach 1:
The mask system is segmented into multiple independent mask bodies that can move individually. This segmentation allows each mask to independently adjust to local variations in carrier bending, maintaining uniform gap across the entire substrate area while using relatively simple individual mask structures.
Solution Approach 2:
The movable mask structure serves multiple functions: it maintains uniform gap for plasma stability, prevents particle contamination from back sputtering, avoids substrate damage from contact, and adapts to carrier bending. This multi-functionality justifies the added complexity by eliminating the need for separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces particle contamination and back sputtering by maintaining a uniform gap, preventing substrate damage and ensuring stable plasma generation by minimizing vibrations and maintaining a consistent separation between masks and the substrate.
Implementation Method 1
a sputtering apparatus for depositing a target material on a substrate, which includes a chamber, a target including the target material in the chamber
Implementation Method 2
When a predetermined voltage is applied between the cathode and the anode, electrons are bombarded with an inert gas and are thus ionized
Implementation Method 3
When the ionized positive ions are accelerated toward the cathode target and collide with the target, a target material is sputtered from the target
Implementation Method 4
The electrons are excited by bombarding neutral atoms to thereby generate plasma. The plasma is maintained when an external potential is maintained and electrons are continuously generated
Data Source
AI summary
A sputtering apparatus for depositing a target material on a substrate includes a chamber, a target in the chamber to provide the target material, a carrier to carry the substrate in the chamber to face the target, and a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier.