Laterally Movable Probe Substrate for Stable Semiconductor Testing
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Solution Overview
Problem
Existing tester interconnect solutions, such as test probes, face challenges in maintaining stable and repeatable electrical contacts during semiconductor device testing due to slippage issues caused by excessive compression force, especially at high probe densities, leading to potential electrical shorts or opens.
Innovation Solution
A probe support substrate that is laterally movable relative to the device under test, allowing for lateral movement upon contact and compression, which reduces slippage by distributing the compression force and maintaining contact reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If compression force between test probe and interconnect structure is increased to achieve stable contact, then electrical contact stability is improved, but probe slippage off interconnect structure occurs
Solution Approach 1:
The probe support substrate is designed to be laterally movable relative to the device under test, allowing the substrate to dynamically adjust its position in response to compression forces. This dynamic adjustment prevents probe slippage by distributing lateral forces across multiple substrates, thereby maintaining stable electrical contact without requiring excessive compression force.
Solution Approach 2:
Multiple probe support substrates are combined to form a probe support array, where each substrate supports multiple test probes. The substrates work collectively to distribute compression forces and prevent slippage, merging individual substrate functions into a coordinated system that enhances overall contact stability.
2Reliability
If lateral movement of probe support substrate is allowed to prevent slippage, then probe contact stability is improved, but device complexity increases
Solution Approach 1:
The probe support substrate utilizes the compression force applied during testing as the driving force for its own lateral movement. The substrate automatically adjusts its position in response to the applied force without requiring external actuators or complex control mechanisms, thereby preventing slippage while minimizing added complexity.
Solution Approach 2:
The laterally movable substrate acts as an intermediary between the test probes and the device under test, absorbing and distributing lateral forces that would otherwise cause probe slippage. This intermediary mechanism simplifies the overall system by providing a passive force-distribution solution rather than requiring active control systems.
Data Source
AI summary
An electrical-test apparatus is provided, which includes a plurality of tester interconnect structures cantilevered from a first side of a substrate. A base may be coupled to a second side of the substrate via one or more interconnect layers. The tester interconnect structures may contact corresponding interconnect structures of a device under test (DUT). In an example, the substrate is laterally movable relative to the DUT along a plane of the substrate, upon contact between the tester interconnect structures and the interconnect structures of the DUT.