Movable Protective Member for Wafer-Level Infrared Optics

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Solution Overview

Problem

Infrared imaging systems with fixed optical components are difficult to adapt to different lenses or filters, leading to contamination risks and reduced performance, and their size can be inconvenient for practical use.

Innovation Solution

A movable protective member, such as a protective paddle or curtain, is used to selectively cover the aperture of an infrared imaging system, translating between closed and open positions during attachment and detachment of optical assemblies to protect the imager from contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If fixed optical components are used in the infrared imager, then the infrared sensors are protected from contamination, but the system cannot be easily adapted to use different lenses or filters

Engineering Contradiction:
Improveprotection from contaminationVSAvoidadaptability to different lenses or filters
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The optical system is divided into two segments: fixed optical components that remain inside the sealed wafer level package to protect sensors, and interchangeable optical assemblies (lenses/filters) that can be attached externally. This segmentation allows the sealed portion to maintain contamination protection while the external portion provides adaptability through interchangeability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interchangeable optical assembly is designed to attach to the front of the fixed optical components, creating a nested configuration where the removable lens/filter assembly encompasses the permanent optical elements. This allows the smaller fixed components to remain protected while the larger interchangeable assembly provides adaptability.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If additional optical components are added to the front of fixed optical components, then different lenses or filters can be used, but the infrared radiation is attenuated and system size increases

Engineering Contradiction:
Improveability to use different lenses or filtersVSAvoidattenuation of infrared radiation
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The optical assemblies are designed with optimized parameters including anti-reflective coatings and material selection to minimize infrared radiation attenuation. By carefully controlling the optical parameters (transmission efficiency, coating properties), the system achieves adaptability while minimizing energy loss.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If additional optical components are added to the front of fixed optical components, then different lenses or filters can be used, but the system size becomes inconvenient for practical use

Engineering Contradiction:
Improveability to use different lenses or filtersVSAvoidsystem size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The optical assembly is designed as a dynamic, removable component rather than a permanent fixture. This allows the system size to be optimized for each specific application by selecting appropriate lens sizes and types, rather than accommodating the largest possible optical component in the design.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12429688B2Protective member for infrared imaging system with detachable optical assembly
Publication Date: 2025.09.30 TELEDYNE FLIR COMMERICAL SYST INC
  • US12429688B2 patent drawing
  • US12429688B2 patent drawing
  • US12429688B2 patent drawing

AI summary

Various techniques are provided for protecting an infrared imager of a wafer level package. In one example, a method includes maintaining a protective member in a first position blocking an aperture of a wafer level package of an imaging system to protect an infrared imager disposed within the wafer level package. The method also includes attaching an optical assembly to the imaging system. The method also includes translating the protective member from the first position to a second position in response to a first force applied by the optical assembly against the imaging system during the attaching. The protective member is displaced from the aperture in the second position to expose the aperture to the optical assembly. Additional methods and systems are also provided.