Movable Protrusion in Coolant Channel for Wafer Temperature Uniformity

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Solution Overview

Problem

Existing methods for achieving uniform temperature distribution on a wafer require design changes, such as adding peripheral coolant channels or optimizing heater patterns, which are not feasible at singular points of rapid heat dissipation without redesigning the mounting table.

Innovation Solution

An assembly with a coolant flow channel and a protrusion component, such as a screw or baffle plate, that can be lifted or rotated within the flow channel to adjust coolant flow velocity and correct temperature distribution singular points without redesigning the mounting table.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a peripheral flow channel is provided to enhance heat dissipation at the edge of the wafer, then in-plane uniformity of temperature distribution is improved, but device complexity and manufacturing difficulty increase due to redesign requirements

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidmounting table structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent introduces a movable protrusion component that can be positioned at different locations within the coolant flow channel. This dynamic adjustment capability allows the system to adapt to different temperature distribution patterns without requiring multiple fixed channel configurations, thereby resolving the contradiction between achieving uniform temperature distribution and avoiding device complexity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the parameter of coolant flow velocity by introducing a protrusion component that can be moved to different positions. By adjusting the flow velocity at specific locations, the system can correct singular points in temperature distribution without redesigning the overall mounting table structure, thus improving temperature uniformity while maintaining device simplicity

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the mounting table is redesigned to correct temperature singular points, then temperature uniformity is improved, but loss of time and productivity decrease due to redesign requirements

Engineering Contradiction:
Improvetemperature uniformityVSAvoidredesign time
Core Design Contradiction:
TemperatureVSLoss of time

Solution Approach 1:

The movable protrusion component enables dynamic adjustment of coolant flow characteristics to address temperature singular points. This eliminates the need for time-consuming redesign cycles, as the same mounting table can be adapted to different temperature distribution issues by simply repositioning the protrusion component

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system allows operators to self-adjust the protrusion component position to correct temperature uniformity issues without requiring engineering redesign. This self-service capability saves time by enabling direct correction of temperature singular points through operational adjustments rather than redesign processes

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables uniform temperature distribution on a substrate without redesigning the mounting table by adjusting the flow velocity of coolant through the use of movable or rotatable protrusion components, effectively correcting heat dissipation responses at singular points.

Implementation Method 1

a flow channel for flowing coolant inside a mounting table

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a protrusion component that is disposed in the coolant flow channel, wherein the protrusion component is liftable or rotatable

Methodology Applied
Scientific EffectFluid flow resistance: Drag

Data Source

PatentUS11569073B2Assembly provided with coolant flow channel, method of controlling assembly provided with coolant flow channel, and substrate processing apparatus
Publication Date: 2023.01.31 TOKYO ELECTRON LTD
  • US11569073B2 patent drawing
  • US11569073B2 patent drawing
  • US11569073B2 patent drawing

AI summary

An assembly provided with a coolant flow channel includes a base in which the coolant flow channel is formed; and a protrusion component that is disposed in the coolant flow channel, wherein the protrusion component is liftable or rotatable.