Movable Seal Vapor Deposition Source Sealing
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Solution Overview
Problem
Current evaporative deposition systems for photovoltaic module production face issues with non-uniform thin film deposition due to thermal energy radiated from vertical source walls, substrate deformation, and material loss from gaps between the substrate and source, leading to inefficiencies and increased costs.
Innovation Solution
A system and method involving a movable seal or actuator to form a seal with the substrate, using a vapor pocket with an undercut perimeter mask or movable inserts to prevent vapor leakage and promote uniform deposition, and an actuator to adjust the position of the source or substrate to minimize thermal transfer and material loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vertical source walls are used in evaporative deposition systems, then the source structure is simple and easy to manufacture, but thermal energy is radiated to the substrate edges causing non-uniform thin film deposition
Solution Approach 1:
The source walls are designed with an asymmetric angled configuration rather than vertical symmetry. The source walls are angled relative to the substrate such that they are not perpendicular to the substrate surface, creating an asymmetric geometry that directs thermal radiation away from the substrate edges while maintaining manufacturing feasibility.
2Device complexity
If vertical source walls are used, then the source design is simple, but particles gain energy upon impacting the wall making deposition less likely near substrate edges
Solution Approach 1:
The source walls are configured at angles that are not perpendicular to the substrate, creating an asymmetric design that prevents particles from gaining excessive energy upon wall impact. This angled configuration redirects particle trajectories to maintain deposition efficiency across the entire substrate surface including edges.
3Adaptability or versatility
If clearance is provided between substrate and source to accommodate substrate deformation, then substrate deformation is accommodated, but gaps form allowing vapor escape and material loss
Solution Approach 1:
The source is designed with movable components including movable seals and adjustable positioning mechanisms that can dynamically adapt to substrate deformation. The movable seals can shift position to maintain contact with the substrate surface, and the source positioning can be adjusted to accommodate thermal expansion or warping of the substrate during the deposition process.
Solution Approach 2:
Movable seal elements are introduced that can flex or shift position to maintain sealing contact with the substrate surface despite deformation. These flexible sealing components adapt to the substrate's shape changes during heating and deposition, preventing vapor escape through gaps.
4Loss of substance
If movable seals and actuators are added to prevent vapor leakage, then material loss is reduced, but device complexity increases
Solution Approach 1:
Movable seals and actuators are introduced to dynamically prevent vapor leakage. The movable seals can shift position to maintain contact with the substrate, and actuators adjust the source or substrate positioning to minimize gaps. These dynamic components are controlled to operate only when needed, balancing the added complexity with the benefit of reduced material loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances film uniformity, reduces material waste, and decreases downtime by preventing vapor escape and thermal energy transfer, resulting in improved efficiency and cost-effectiveness in thin film deposition processes.
Implementation Method 1
the at least one movable seal is configured to form a first seal with a first portion of the substrate, and wherein the first seal is configured to prevent a vapor from leaking past the first portion of the substrate out of the vapor pocket
Implementation Method 2
the source 1100 is heated sufficiently such that the deposition material 1200 reaches a sublimation point. At the sublimation point, particles 1210 of the deposition material 1200 separate and enter a vapor pocket 1300
Implementation Method 3
the particles 1210, or vapor 1210, will travel through the vapor pocket 1300 and condense evenly across the surface of substrate 3000 forming a thin film
Implementation Method 4
the surface temperature of the substrate 3000 must be low enough to absorb the latent heat within the particle 1210
Implementation Method 5
thermal energy radiated directly to the substrate 3000 heating the edges of the substrate 3000 near the walls 1110
Data Source
AI summary
A system and method for movably sealing a vapor deposition source is described. One embodiment includes a system for coating a substrate, the system comprising a deposition chamber; a vapor pocket located within the deposition chamber; and an at least one movable seal, wherein the at least one movable seal is configured to form a first seal with a first portion of a substrate, and wherein the first seal is configured to prevent a vapor from leaking past the first portion of the substrate out of the vapor pocket. In some embodiments, the movable seal may comprise a first flange, wherein the first flange forms a wall of the vapor pocket; and a second flange, wherein the second flange is configured to be movably disposed within a first groove of the source block.