Movable Shielding Cover Assembly for Variable Chip Heights
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Solution Overview
Problem
Conventional heat dissipation and electromagnetic interference shielding technologies in mobile terminal devices face challenges in adapting to chips of different heights and assembly gaps, leading to poor shielding performance and heat dissipation inefficiencies in high-density layouts.
Innovation Solution
A circuit board assembly design featuring a shielding component with a movable shielding cover connected to a shielding frame, allowing vertical movement to accommodate varying chip heights and assembly gaps, combined with a heat conducting member and elastic shielding components for enhanced heat dissipation and interference suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed shielding structure is used to enclose the heat generating chip, then electromagnetic interference shielding is achieved, but the structure cannot adapt to chips of different heights and assembly gaps
Solution Approach 1:
The shielding cover is designed to be movable relative to the shielding frame through a movable connection mechanism, allowing the shielding structure to dynamically adjust to different chip heights and assembly gaps while maintaining reliable electromagnetic interference shielding. The movable connection enables the shielding cover to adapt its position without compromising the enclosed sealing space.
Solution Approach 2:
The shielding structure allows for parameter changes in the vertical position of the shielding cover to accommodate variations in chip height and assembly gap dimensions. This parameter adjustment capability enables the same shielding structure to reliably adapt to different chip specifications while maintaining effective electromagnetic shielding.
2Adaptability or versatility
If the shielding cover is rigidly connected to the shielding frame, then structural stability is improved, but the structure cannot adapt to different chip heights and assembly gaps
Solution Approach 1:
The movable connection between the shielding cover and shielding frame introduces dynamic adaptability while maintaining structural stability. The connection mechanism allows controlled movement to accommodate different chip heights while preserving the overall structural integrity and stability of the shielding assembly.
3Adaptability or versatility
If the shielding cover is rigidly connected to the shielding frame, then connection reliability is improved, but the shielding frame cannot provide buffer space under heat sink pressure
Solution Approach 1:
The movable connection mechanism enables the shielding cover to move relative to the shielding frame, providing buffer space to absorb heat sink pressure while maintaining connection reliability. This dynamic connection prevents excessive force transmission that could damage the solder joint between the shielding frame and circuit board.
Solution Approach 2:
The movable connection acts as a pre-designed cushioning mechanism that anticipates and absorbs the pressure from the heat sink. This beforehand cushioning protects the connection between the shielding frame and circuit board from damage by providing a compliant interface that absorbs mechanical stress.
4Loss of energy
If a conventional fixed shielding structure is used, then electromagnetic interference shielding is achieved, but heat dissipation efficiency is reduced in high-density layouts
Solution Approach 1:
The movable shielding cover enables optimized heat dissipation pathways by allowing the shielding structure to adapt to different chip heights and assembly configurations. This dynamic adjustment improves heat dissipation efficiency in high-density layouts while the modular design keeps the overall device complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively adapts to different chip heights and assembly gaps, improving heat dissipation and electromagnetic interference shielding performance, ensuring reliable operation and stability in high-density chip layouts while preventing structural deformation and connection failures.
Implementation Method 1
the other side of the chip component is in contact with the heat sink
Implementation Method 2
the shielding cover is movably connected to the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame
Implementation Method 3
the shielding structure is located on a periphery of the heat generating chip, so that the heat sink, the shielding structure, and the circuit board enclose to form sealed space, to achieve shielding effect of avoiding signal interference
Data Source
AI summary
Embodiments of this application provide a circuit board assembly and an electronic device. In the circuit board assembly, at least one first shielding component is disposed on a periphery of a chip component, each first shielding component includes a shielding frame and a shielding cover, an end that is of the shielding frame and that is away from the shielding cover is fastened to a first circuit board, at least a part of the shielding cover is located between the chip component and a heat sink, and the shielding cover is movably connected to the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame. In this way, the first shielding component can adapt to chip components of different heights and different assembly gaps.