Movable Spiral Electrode for Uniform Plasma Processing

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Solution Overview

Problem

The plasma distribution in semiconductor manufacturing processes is non-uniform due to variations in the shape of the process container, electrode position, electromagnetic field strength, and processing conditions, leading to inconsistent pattern formation on substrates.

Innovation Solution

A substrate processing apparatus with a movable resonance coil and shielding plate, controlled by a mover system, to adjust the plasma distribution uniformly across the process container's circumference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a fixed spiral electrode is used to generate plasma, then plasma generation is achieved, but plasma distribution becomes non-uniform along the circumferential direction due to variations in process container shape and electrode position

Engineering Contradiction:
Improveplasma distribution uniformityVSAvoidelectrode positioning mechanism
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The electrode is made movable along the radial direction of the process container through a positioning mechanism. This dynamic adjustment capability allows the electrode to be positioned at optimal distances from the container wall, compensating for shape variations and achieving uniform plasma distribution along the circumferential direction, thereby resolving the contradiction between plasma uniformity and device complexity.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If the electrode position is adjusted to optimize plasma distribution, then manufacturing precision improves, but the device structure becomes more complex

Engineering Contradiction:
Improvepattern formation consistencyVSAvoidmover mechanism
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A mover mechanism is introduced to enable radial adjustment of the electrode position. This dynamic positioning system allows optimization of the electrode-container distance to achieve uniform plasma distribution and consistent pattern formation, while the mechanism is designed to minimize structural complexity through efficient actuation and support elements.

Inventive Principle:
Principle #15Dynamics

3Productivity

If the electrode is positioned closer to the process container to enhance plasma generation, then processing efficiency improves, but plasma distribution uniformity deteriorates due to electromagnetic field variations

Engineering Contradiction:
Improveprocessing speedVSAvoidplasma distribution uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The movable electrode positioning mechanism enables dynamic optimization of the electrode-container distance. By adjusting the electrode to an optimal position that balances proximity (for processing efficiency) and distance (for field uniformity), the system achieves both high productivity and uniform plasma distribution, resolving the contradiction between processing speed and pattern consistency.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system utilizes adjustable electrode position as a controllable parameter to optimize plasma generation. By changing the radial distance between the electrode and process container, the electromagnetic field strength and plasma distribution can be tuned to achieve both high processing efficiency and uniform plasma coverage along the circumferential direction.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures uniform plasma distribution and consistent film formation on substrates, addressing the non-uniformity issues caused by container shape and electrode variations.

Implementation Method 1

an electrode installed in a spiral shape to surround the process container from outside of the cylindrical portion of the process container and supplied with high-frequency power to plasma-excite the processing gas

Methodology Applied
Scientific EffectPlasma excitation: Plasma

Data Source

PatentUS12603253B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
Publication Date: 2026.04.14 KOKUSAI DENKI KK
  • US12603253B2 patent drawing
  • US12603253B2 patent drawing
  • US12603253B2 patent drawing

AI summary

There is provided a technique that includes a process container including a cylindrical portion, a process chamber being formed in the process container and a substrate being arranged in the process chamber; a gas supplier configured to supply a processing gas to the process chamber; an electrode installed in a spiral shape to surround the process container from outside of the cylindrical portion of the process container and supplied with high-frequency power to plasma-excite the processing gas; and a mover configured to be capable of moving the electrode with respect to the process container in a radial direction of the cylindrical portion.