Movable Sub-Housing Heat Dissipation Device for 5G Equipment
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Solution Overview
Problem
Current heat dissipation methods in network access equipment, such as small holes at the bottom and top for convective heat exchange, are inefficient due to long air duct lengths and blockages, leading to ineffective heat mitigation, especially in high-power scenarios like 5G technology where increased power consumption generates more heat.
Innovation Solution
A heat dissipation device with a housing comprising a first and second sub-housing that can move relative to each other, exposing holes in the second sub-housing to form an adjustable air duct near high heat generation areas, optimizing convection cooling by shortening the air duct and reducing fan wind resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If small holes are opened at the bottom and top of the apparatus for convective heat exchange, then heat dissipation can be implemented, but the heat dissipation efficiency is low due to long air duct lengths and concealed hole positions
Solution Approach 1:
The housing is divided into a first sub-housing and a second sub-housing that can move relative to each other. The second sub-housing can slide along the first sub-housing to expose or cover holes, dynamically adjusting the air duct configuration. This dynamic structure allows the air duct length to be adapted based on heat dissipation needs, solving the contradiction between maintaining heat dissipation function and reducing air duct length.
Solution Approach 2:
The housing is segmented into multiple sub-housings with separate functional areas. The first sub-housing contains the air outlet and fan, while the second sub-housing contains the air inlet holes. This segmentation allows independent optimization of each section and enables the holes to be positioned optimally for heat dissipation without being constrained by a fixed single-structure housing.
2Temperature
If holes are positioned at concealed locations in the housing, then the appearance is maintained, but heat dissipation is limited and cold air cannot effectively reach high heat generation areas
Solution Approach 1:
The relative movement capability between the first and second sub-housings allows the hole positions to be dynamically adjusted. When heat dissipation is needed, the second sub-housing slides to expose the holes, creating direct air flow paths to high heat generation areas. This dynamic adjustment resolves the contradiction between concealed hole positions for appearance and accessible hole positions for effective heat dissipation.
3Temperature
If internal structures are present in the housing, then the apparatus functionality is complete, but air flow is blocked and heat generation cannot be effectively mitigated
Solution Approach 1:
By segmenting the housing into separate sub-housings, the air flow path is separated from internal structures. The second sub-housing with air inlet holes can be positioned to create a dedicated air flow channel that bypasses internal structures, reducing blockage while maintaining complete apparatus functionality within the segmented structure.
Solution Approach 2:
The movable second sub-housing acts as an intermediary element that mediates between the external environment and internal structures. It creates a controlled air flow path that can access high heat generation areas without being blocked by internal structures, as the sub-housing itself forms the boundary of the air flow channel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency by allowing cold air to quickly reach high heat generation areas, improving hardware performance and user experience in 5G and other communication equipment by actively adjusting the air duct based on temperature conditions.
Implementation Method 1
cold air to be sucked in from the bottom and discharged from the top through convection to implement heat exchange
Data Source
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AI summary
A heat dissipation device is disclosed. The heat dissipation device includes a housing. The housing includes a first sub-housing and a second sub-housing. The second sub-housing is configured to be adjacent to a bottom of the heat dissipation device, and the first sub-housing is configured to be adjacent to a top of the heat dissipation device. One or more holes are provided in a part of the second sub-housing overlapping the first sub-housing, and the first sub-housing and the second sub-housing are capable of relative movement. The relative movement is capable of exposing the one or more holes provided in the second sub-housing to form an air duct.