Movable Support Tool for Circuit Board During Solder Flow

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Solution Overview

Problem

Existing work machines face challenges in supporting circuit boards during lead insertion into through-holes without obstructing the movement of solder flow devices, leading to potential warping and reduced practicality.

Innovation Solution

A work machine design that includes a holding device for electronic components, a flow device for applying solder, a first moving device to position the flow device, a support tool to stabilize the circuit board, and a second moving device to reposition the support tool without interfering with the flow device's operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a support tool is arranged under the circuit board to prevent warping during lead insertion, then the circuit board stability is improved, but the movement freedom of the flow device is restricted

Engineering Contradiction:
Improvecircuit board stabilityVSAvoidflow device movement freedom
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The support tool is designed with movable capabilities, transitioning from a static to a dynamic component. The second moving device enables the support tool to reposition itself, allowing it to move out of the way when the flow device needs to operate and return to support the circuit board when needed, thus resolving the contradiction between stability and movement freedom

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system is divided into independently controllable components: the flow device with its first moving device, and the support tool with its second moving device. This segmentation allows each component to operate independently - the flow device can move freely when the support tool is repositioned, and the support tool can provide stability when positioned appropriately, eliminating the mutual restriction

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If the flow device is made movable to any position under the circuit board, then the solder application flexibility is improved, but the ability to support the circuit board simultaneously is worsened

Engineering Contradiction:
Improvesolder application flexibilityVSAvoidcircuit board support capability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

Both the flow device and support tool are equipped with moving devices, making them dynamic components that can reposition themselves. This allows the flow device to move to any position for solder application while the support tool can simultaneously reposition to provide or withdraw support as needed, resolving the contradiction between flexibility and support capability

Inventive Principle:
Principle #15Dynamics

3Productivity

If pressure is applied to insert the lead into the through-hole, then the lead insertion effectiveness is improved, but the circuit board warping risk increases

Engineering Contradiction:
Improvelead insertion effectivenessVSAvoidcircuit board warping
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The support tool is positioned under the circuit board before lead insertion begins. This preliminary support action prepares the system to withstand the pressure that will be applied during lead insertion, preventing warping before it occurs while allowing effective pressure application for successful lead insertion

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for separate movement of the flow device and support tool, enabling effective solder application while supporting the circuit board as needed, thereby enhancing the machine's practicality and preventing warping.

Implementation Method 1

a flow device configured to flow molten solder from under the circuit board towards the lead inserted into the through-hole

Methodology Applied
Scientific EffectFluid flow:

Data Source

PatentEP3291658B1Working machine
Publication Date: 2021.01.13 FUJI CORP
  • EP3291658B1 patent drawingFigure 1
  • EP3291658B1 patent drawingFigure 2
  • EP3291658B1 patent drawingFigure 3

AI summary

With the work machine of the present invention, flow device 100 for flowing molten solder from under a circuit board, and backup pin 124 for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.