Movable Supporting Pins for Liquid Crystal Panel Heating
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Solution Overview
Problem
In the liquid crystal panel manufacturing process, the fixed positions of supporting pins in the heating platform lead to uneven heating, causing the mura phenomenon due to temperature differences, which results in brightness irregularities on the panel, especially when different types of substrates are used.
Innovation Solution
A supporting structure with sliding slots and positioning regions allows the supporting pins to be moved and secured at different positions on the heating platform, ensuring they are always in a non-display region, using a fixing frame, supporting strip, and ceramic pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If supporting pins are installed on fixed locations of the heating platform, then the substrate can be supported at a certain distance from the heating platform to ensure heating uniformity, but the fixed positions cause temperature differences between contacted and non-contacted areas, generating mura phenomenon
Solution Approach 1:
The patent makes the supporting pins movable along the sliding slot instead of fixed, allowing dynamic adjustment of pin positions. The fixing portion can slide within the slot and be secured at different positions using fasteners, enabling the system to adapt to different substrate types and avoid mura phenomenon while maintaining heating uniformity.
Solution Approach 2:
The heating platform with movable supporting pins can support multiple types of substrates with different sizes and shapes. By adjusting the pin positions along the sliding slot, the same heating platform becomes universal for different substrate types, preventing the pins from being located in effective display regions.
2Ease of manufacture
If supporting pins are installed on fixed locations, then the structure is simple and easy to manufacture, but the positions cannot be adjusted for different substrate types, causing supporting pins to be located in effective regions
Solution Approach 1:
The supporting pin structure transitions from fixed to movable along a sliding slot, with the fixing portion capable of sliding and being secured at multiple positions. This dynamic design maintains structural simplicity while enabling adjustment for different substrate types.
Solution Approach 2:
The supporting structure is divided into separable components: the fixing portion that slides, the fasteners for securing, and the supporting pins. This segmentation allows easy adjustment of pin positions while maintaining overall structural simplicity and ease of manufacture.
3Object-affected harmful factors
If supporting pins are moved to ineffective regions, then mura phenomenon is avoided, but the positions must be adjusted for different substrate types which increases device complexity
Solution Approach 1:
The supporting pins are made movable along simple sliding slots with fasteners, creating a low-complexity mechanism that can adjust positions to place pins in ineffective regions and avoid mura phenomenon.
Solution Approach 2:
The sliding slot acts as an intermediary mechanism between the fixed heating platform and the movable supporting pins, enabling position adjustment with minimal complexity. The fasteners serve as intermediaries to secure the fixing portion at desired positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents the mura phenomenon by allowing the supporting pins to be positioned optimally for any substrate type, ensuring uniform heating and avoiding brightness irregularities on liquid crystal panels.
Implementation Method 1
a substrate printed with a PI liquid is required transferring a heating platform having a temperature around 100° C. for performing a prebaking process such that a solvent in the PI liquid is evenly volatilized and form a film
Implementation Method 2
using supporting pins having a certain height to support the substrate such that a certain distance is maintained between the substrate and the heating platform in order to ensure the heating uniformity of the PI liquid on the surface of the substrate
Data Source
AI summary
A supporting structure for supporting a substrate in an oven is disclosed. The oven is for baking the substrate in a production process of liquid crystal panel. The supporting structure includes: a fixing frame including a frame body, and a fixing portion and a support portion fixed to the frame body, wherein the fixing portion provides with a sliding slot, the fixing portion is provided with at least one positioning region located inside the sliding slot, through a fastener passing through the positioning region, the fixing portion is secured and fixed to a heating platform of the oven such that the frame body is fixed to the heating platform; a supporting strip engaged at the support portion; and multiple supporting pins disposed separately on the supporting strip to support the substrate. The supporting structure can move positions of the supporting pins. An oven applying the supporting structure is also disclosed.