Movable Temperature Sensor for Hot Stamping Die
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Solution Overview
Problem
In hot stamping processes, existing temperature sensing methods for hot stamping die apparatuses face challenges such as damage from high impact pressures when using contact sensors and temperature measurement errors due to irregular emissivity with non-contact infrared sensors, leading to ineffective yield control and phase change monitoring.
Innovation Solution
A temperature sensing device with a linkage mode, featuring a processor, moving rod, buffer, and temperature sensor, which moves to touch the workpiece only during pressing, controlled by a displacement regulator and controller, ensuring precise temperature sensing and controlled contact force, thus extending the sensor's service life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a contact temperature sensor is fixedly disposed in the die to directly sense temperature, then temperature sensing is achieved, but the sensor is easily damaged due to high impact pressure
Solution Approach 1:
The temperature sensor is made movable through a linkage mechanism consisting of a moving rod, buffer, and displacement regulator. The sensor moves from a retracted position to a contact position with the workpiece only when needed, transforming from a static fixed arrangement to a dynamic controlled system. This resolves the contradiction by allowing the sensor to be in contact with the workpiece only during measurement, avoiding continuous exposure to impact forces.
Solution Approach 2:
A linkage mechanism acts as an intermediary between the fixed die mounting and the temperature sensor. The mechanism includes a moving rod connected to a buffer (spring or damper), which mediates the transmission of motion while isolating the sensor from direct impact forces. The displacement regulator controls the extent of movement, ensuring the sensor contacts the workpiece gently only when required for measurement.
2Reliability
If a non-contact infrared temperature sensor is used, then sensor durability is improved, but temperature measurement error occurs due to irregular emissivity of metal material
Solution Approach 1:
The patent introduces a movable linkage mechanism as an intermediary that enables contact measurement without the drawbacks of fixed mounting. The buffer (spring or damper) in the linkage acts as a mediator that allows gentle contact between the sensor and workpiece, achieving both contact-based accuracy and protected sensor durability through controlled interaction rather than direct rigid contact.
3Reliability
If the moving rod moves a long distance to ensure sensor contact, then contact reliability is improved, but excessive impact force damages the sensor
Solution Approach 1:
The buffer (spring or damper) is pre-installed in the linkage mechanism to provide cushioning before contact occurs. As the moving rod travels toward the workpiece, the buffer compresses or dampens the motion in advance, absorbing excess kinetic energy and reducing impact force. This beforehand cushioning ensures reliable contact while protecting the sensor from damage.
Solution Approach 2:
The buffer serves as an intermediary element between the moving rod and the temperature sensor, mediating the transmission of motion and force. It allows the moving rod to travel the necessary distance for reliable contact while transforming the motion into a controlled, low-impact contact that protects the sensor from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides precise temperature sensing with a long service life by controlling contact force and avoiding excessive impact, reducing damage and measurement errors, enabling effective yield control and phase change monitoring in hot stamping processes.
Implementation Method 1
If a moving distance of the moving rod exceeds an original distance between the temperature sensor and the workpiece, extra movement is absorbed through internal contraction of the buffer
Implementation Method 2
the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece
Data Source
AI summary
A temperature sensing device for a hot stamping die apparatus includes: a processor, wherein when a second die moves toward a first die to press a workpiece, a pushing signal is transmitted to the processor; at least one temperature sensing unit is disposed in the first die and includes: a moving rod, a buffer, and a temperature sensor; a displacement regulator; and a controller, whereby when the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.