Movable Thermal Acoustic Panel for Rack Airflow Noise Trade-off

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Solution Overview

Problem

Computing enclosure racks face a challenge in balancing airflow and noise attenuation, as designs that enhance airflow often compromise noise dissipation, and vice versa, affecting the efficient operation of electrical components.

Innovation Solution

A configuration controller is used to modify the spatial orientation of thermal acoustic panels within the computing enclosure rack, allowing for real-time adjustment of their position to optimize both thermal and acoustic dissipation based on user preferences and environmental conditions, utilizing panel movers and sensors to coordinate movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the computing enclosure rack is designed to increase airflow, then thermal dissipation is improved, but the ability to dissipate noise is reduced

Engineering Contradiction:
Improvethermal dissipationVSAvoidnoise dissipation
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The thermal acoustic panel is made movable relative to the computing enclosure rack body, allowing dynamic adjustment between different spatial orientations. This enables the system to adapt between maximizing airflow (thermal dissipation) and maximizing noise attenuation based on operational requirements, resolving the static contradiction between these two functions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the spatial orientation parameter of the thermal acoustic panel to achieve different functional states. By adjusting the panel's position and orientation, the system can optimize either thermal dissipation or noise attenuation performance, allowing parameter-based adaptation to resolve the contradiction.

Inventive Principle:
Principle #35Parameter changes

2Object-generated harmful factors

If the thermal acoustic panel is positioned to maximize noise attenuation, then noise dissipation is improved, but airflow is reduced

Engineering Contradiction:
Improvenoise attenuationVSAvoidairflow
Core Design Contradiction:
Object-generated harmful factorsVSQuantity of substance

Solution Approach 1:

The movable thermal acoustic panel enables dynamic repositioning to balance noise attenuation and airflow requirements. When noise attenuation is prioritized, the panel assumes a position that maximizes acoustic blocking while maintaining adequate airflow paths, resolving the contradiction through adaptive positioning.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The thermal acoustic panel is designed as a separate, movable component that can be independently positioned relative to the rack body. This segmentation allows the panel to be optimally positioned for either noise attenuation or airflow, and the system can switch between these states as needed.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables dynamic adjustment of the thermal acoustic panels to achieve a balance between airflow and noise attenuation, improving the overall efficiency and performance of the computing enclosure rack by optimizing thermal and acoustic settings in real-time.

Implementation Method 1

the electrical components of the computing systems generate heat and noise. To cool the components, airflow is often directed through the computing enclosure rack. However, designing the computing enclosure rack to increase airflow may reduce the ability of the computing enclosure rack to dissipate noise generated by the components.

Methodology Applied
Scientific EffectAcoustic absorption: Acoustic Absorption

Implementation Method 2

To cool the components, airflow is often directed through the computing enclosure rack.

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS8917504B2Modifying the spatial orientation of a thermal acoustic panel of a computing enclosure rack
Publication Date: 2014.12.23 LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
  • US8917504B2 patent drawing
  • US8917504B2 patent drawing
  • US8917504B2 patent drawing

AI summary

Methods, apparatuses, and computer program products for modifying the spatial orientation of a thermal acoustic panel of a computing enclosure rack are provided. Embodiments include receiving, by a configuration controller, a configuration preference from a user; identifying, by the configuration controller, a spatial orientation configuration corresponding to the configuration preference received from the user; and coordinating, by the configuration controller, movement of the thermal acoustic panel relative to a body of the computing enclosure rack in accordance with the identified spatial orientation configuration.