Movable Thermal Conductor for Device-to-Device Isothermalization
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Solution Overview
Problem
High power density electronic systems face thermal management challenges due to spatially and temporally varying hot spots, leading to thermomechanical stresses and reliability issues, as traditional thermal management methods fail to mitigate temperature variations between multiple electronic devices effectively.
Innovation Solution
An active thermal management system featuring a heat spreader with an internal channel and a moveable thermally conductive body that adjusts its position to minimize temperature differentials between electronic devices, allowing for controlled heat flow and isothermalization by altering the path of heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal management approaches (heat spreaders, cold plates) are used, then heat can be removed from hot spots, but temperature variations between multiple electronic devices cannot be effectively mitigated
Solution Approach 1:
The patent implements a movable thermally conductive body within an internal channel that can dynamically reposition itself based on real-time temperature measurements. This dynamic adjustment allows the system to adapt to varying thermal conditions and actively minimize temperature differentials between electronic devices, resolving the contradiction between temperature uniformity and device reliability.
Solution Approach 2:
The system incorporates temperature sensors that continuously monitor thermal conditions and provide feedback to a controller, which then actuates the movable thermally conductive body to optimal positions. This closed-loop feedback mechanism enables real-time optimization of heat distribution, ensuring both temperature uniformity and device reliability are maintained.
2Productivity
If compact layout is used to reduce volume and weight, then power density increases, but electro-thermal obstacles arise that prevent full potential of wide bandgap devices
Solution Approach 1:
The movable thermally conductive body enables dynamic thermal management within the compact layout, allowing the system to maintain high power density while actively adjusting heat distribution to prevent thermal obstacles. The dynamic repositioning capability ensures optimal thermal performance despite the constrained space.
Solution Approach 2:
The system applies local thermal management by positioning the movable thermally conductive body to specifically address hot spots and temperature variations in different regions of the compact layout. This localized approach allows each area to receive appropriate thermal management, enabling high power density without compromising overall thermal performance.
3Adaptability or versatility
If variable power loss in electronic devices occurs, then spatially and temporally varying hot spots are generated, but traditional thermal management cannot mitigate these variations
Solution Approach 1:
The movable thermally conductive body provides dynamic adaptability to handle variable power losses by repositioning itself in response to changing thermal conditions. This allows the system to effectively mitigate spatially and temporally varying hot spots that traditional static thermal management cannot address.
Solution Approach 2:
The system changes thermal parameters dynamically by adjusting the position of the movable thermally conductive body based on real-time temperature measurements. This parameter adjustment enables the system to adapt to variable power losses and maintain temperature uniformity despite changing operational conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermomechanical stresses and improves reliability by achieving device-to-device isothermalization, enhancing the performance and efficiency of high power density electronic systems by minimizing temperature differentials and optimizing heat dissipation.
Implementation Method 1
Heat spreaders, which are solid structures through which heat flows by thermal conduction, may be effective at providing a path for heat removal from heat-generating electronics to a heat sink or other heat removal element.
Data Source
AI summary
An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (ΔT) between the electronic devices.