Moveable-Contact High-Density Connector for Compact Pin Expansion
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Solution Overview
Problem
Existing edge connectors in data storage devices face challenges with limited connection pin density due to multiple rows of pins leading to durability issues and potential shorts, and increasing width is not feasible due to size constraints.
Innovation Solution
A high density connector design with moveable rows of electrical contacts that pivot between planes to accommodate additional pins without increasing width, ensuring proper alignment and reducing shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple rows of connection pins are included on each surface to accommodate more pins, then connection pin density increases, but the durability of the first row of connection pins decreases due to twice the insertion cycles
Solution Approach 1:
The patent introduces a second dimension (elevation/vertical plane) by positioning electrical contacts at different elevations within the housing. The first row of electrical contacts is at a first elevation and the second row is at a second elevation, allowing both rows to be accommodated without increasing the horizontal footprint, thereby solving the contradiction between pin density and durability
Solution Approach 2:
The patent makes the second row of electrical contacts moveable between a first position (retracted) and a second position (extended). During hot insertion, the moveable contacts remain retracted to avoid contact, and only engage when properly positioned, reducing unnecessary wear cycles and improving durability while maintaining high pin density
2Quantity of substance
If multiple rows of connection pins are included on each surface to accommodate more pins, then connection pin density increases, but the risk of shorts increases during hot insertion and removal
Solution Approach 1:
The second row of electrical contacts is designed to be moveable between a retracted first position and an extended second position. During hot insertion and removal operations, the moveable contacts remain in the retracted first position, preventing unintended contact with connection pins and eliminating the risk of shorts, while still allowing full connectivity when properly mated
Solution Approach 2:
The connector is designed so that the moveable second row of electrical contacts is preliminarily positioned in the retracted first position before insertion occurs. This preliminary retraction state prevents shorts during hot swapping operations, and the contacts are only extended to the second position when the edge connector is properly inserted and mated
3Quantity of substance
If the width of the edge connector is increased to accommodate more connection pins, then connection pin density increases, but the width constraints of the PCIe connector on the motherboard are violated
Solution Approach 1:
The patent resolves the width constraint contradiction by utilizing the vertical elevation dimension within the existing connector width. By stacking electrical contacts at different elevations (first elevation and second elevation) within the housing, the design accommodates more connection pins without increasing the horizontal width of the connector, maintaining compatibility with standard PCIe form factors
Data Source
AI summary
A high density connector for receiving an electronic component includes a housing, a first row of electrical contacts in a first plane and a second row of electrical contacts in a second plane. The second plane is above the first plane. The high density connector also includes a connector contact. When an edge connector of the electronic component is received in the housing, the edge connector contacts the connector contact. The connector contact rotates about an axis and moves the second row of electrical contacts from the second plane toward to the first plane. When the second row of electrical contacts is in the first plane, the second row of electrical contacts is electrically coupled to a second row of connection pins on the electronic component.