Moveable Drain Assembly for Wafer Fluid Segregation

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Solution Overview

Problem

Current semiconductor manufacturing processes face challenges with cross contamination of process fluids when recirculating different fluids within the same processing chamber, leading to inefficiencies and increased costs due to the need for extensive equipment handling and fluid mixing.

Innovation Solution

A moveable drain assembly with multiple drain rings allows for separate recirculation loops for each process fluid, enabling uniform application and separate removal of fluids, reducing the likelihood of mixing and minimizing equipment handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If different process fluids are recirculated within the same processing chamber, then manufacturing costs are reduced and less waste material is created, but cross contamination between process fluids occurs

Engineering Contradiction:
Improvemanufacturing costsVSAvoidcross contamination
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The processing chamber is segmented into multiple zones with separate drain rings for each process fluid. Each drain ring collects a specific process fluid independently, preventing mixing while allowing multiple fluids to be recirculated in the same chamber. This segmentation enables cost-effective multi-fluid processing without cross-contamination.

Inventive Principle:
Principle #1Segmentation

2Productivity

If process fluids are applied to wafer surfaces, then processing operations are performed, but controlling and removing process fluids becomes complex

Engineering Contradiction:
Improveprocessing operationsVSAvoidfluid control
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The drain rings are positioned to automatically collect process fluids as they flow off the wafer surfaces during processing. The system uses the natural flow and centrifugal forces to direct fluids to the appropriate drain rings, eliminating the need for complex active control mechanisms while maintaining effective fluid management.

Inventive Principle:
Principle #25Self-service

3Productivity

If wafers are moved and handled in processing systems, then processing steps are completed, but contaminant particles are generated

Engineering Contradiction:
Improveprocessing stepsVSAvoidcontaminant particles
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The drain rings extract and remove process fluids and any suspended contaminant particles from the processing chamber after they have served their purpose on the wafer surfaces. By continuously removing fluids that may contain contaminants, the system minimizes particle generation and accumulation during wafer handling and processing operations.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves process performance by preventing fluid mixing, reducing contamination, and lowering manufacturing costs through efficient fluid management and handling within a single processing chamber.

Implementation Method 1

collect process fluid moving off of the workpiece

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS7849865B2System for processing a workpiece
Publication Date: 2010.12.14 APPLIED MATERIALS INC
  • US7849865B2 patent drawing
  • US7849865B2 patent drawing
  • US7849865B2 patent drawing

AI summary

A wafer processing system has a moveable drain assembly having multiple drain rings. The drain rings may be spaced apart sufficiently to allow a process fluid applicator to move between them. Each drain ring provides a separate drain path, optionally in a separate recirculation loop carrying a single process fluid. The drain rings may be sequentially moved into position to collect process fluid moving off of the workpiece. As a result, process fluids may be more uniformly applied and used process fluids can be separately removed, collected, and either recycled or processed for disposal. Mixing of used process fluids is largely avoided. A lower process fluid outlet allows for processing the back side of the wafer as well, without flipping the wafer.