Moveable Pogo Pin IC Socket for Multi-Footprint Compatibility
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Solution Overview
Problem
Conventional IC chip sockets are limited to specific footprint sizes, making it difficult to accommodate a wide range of IC chip sizes and often result in chips getting stuck during removal.
Innovation Solution
A flexible IC chip socket design featuring moveable pogo pins that can be positioned both actively and inactive, allowing them to contact or avoid leads of the IC chip, accommodating various sizes and ensuring easy removal by maintaining upward force during insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional IC chip sockets are designed for specific footprint sizes, then the socket structure is simple and fixed, but it cannot accommodate a wide range of IC chip sizes
Solution Approach 1:
The patent applies the dynamics principle by making the pogo pins moveable rather than fixed. Each pogo pin can be positioned independently to contact leads at different locations on the IC chip, allowing the socket to adapt to various chip footprint sizes. The moveable positioning mechanism enables the same socket to accommodate different chip sizes without requiring multiple specialized sockets.
2Ease of operation
If conventional IC chip sockets have fixed contact points, then the structure is stable, but chips may get stuck during removal
Solution Approach 1:
The pogo pins are designed to be moveable rather than fixed, allowing them to dynamically adjust during chip insertion and removal. This moveability prevents chips from getting stuck while maintaining reliable electrical contact through spring-loaded mechanisms that ensure consistent contact pressure.
Solution Approach 2:
The contact structure is segmented into multiple independent pogo pins rather than a single fixed contact structure. Each pogo pin can move independently, allowing distributed contact points that reduce the likelihood of chips getting stuck while maintaining overall contact stability through the collective action of multiple pins.
3Adaptability or versatility
If moveable pogo pins are used to accommodate various IC chip sizes, then adaptability is improved, but the positioning and control mechanism becomes more complex
Solution Approach 1:
The positioning mechanism is segmented into independent control systems for each pogo pin, allowing individual positioning without requiring a complex centralized control mechanism. This modular approach reduces overall system complexity while maintaining the ability to accommodate various IC chip footprint sizes.
Solution Approach 2:
The system controls pogo pin positions by changing parameters such as pin extension length or horizontal position within the housing. By controlling specific parameters of each pogo pin independently, the system achieves adaptability to various chip sizes without requiring an overly complex positioning mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the testing of a large range of IC chip footprint sizes and prevents chips from getting stuck, allowing for wider compatibility and easier removal compared to conventional sockets.
Implementation Method 1
the pogo pin usually takes the form of a slender cylinder containing a sharp, spring-loaded pin
Implementation Method 2
each active pogo pin is moveable in a direction substantially perpendicular to an insertion direction of a IC chip insertable into the IC chip socket
Data Source
AI summary
An integrated circuit (IC) chip socket that can include a non-conductive housing and moveable pogo pins positioned within the non-conductive housing. The moveable pogo pins can include active pogo pins, each active pogo pin being positioned to a corresponding lead of an IC chip insertable into the IC chip socket. Moveable pogo pins can also include an inactive pogo pin positioned to avoid contacting each lead of the IC chip insertable into the IC chip socket.