Moveable Heat Spreaders for Serviceable Electronics Enclosures
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Solution Overview
Problem
Electronics enclosures face challenges in dissipating heat effectively due to increased power consumption and tightly packed heat-generating components, necessitating improved cooling solutions that also allow for easy serviceability.
Innovation Solution
A device comprising a housing with moveable heat spreaders that can be easily coupled and decoupled to a chassis, utilizing wedges and couplers to facilitate heat transfer to cold plates, allowing for efficient heat dissipation and serviceability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced airflow cooling is used, then heat dissipation capability is improved, but serviceability deteriorates due to tightly packed components
Solution Approach 1:
The cooling system is segmented into a fixed heat spreader attached to the housing and a separate moveable heat spreader that can be independently manipulated. This segmentation allows the moveable heat spreader to be adjusted or removed without affecting the entire cooling system or the tightly packed electronic components, thereby improving serviceability while maintaining heat dissipation capability.
Solution Approach 2:
The heat spreader is designed with moveable portions that can dynamically adjust their position relative to the housing. This dynamic capability enables the heat spreader to be moved away from the housing for serviceability purposes and then returned to its cooling position, resolving the contradiction between maintaining effective heat dissipation and enabling easy repair access.
2Temperature
If heat spreader is fixed to housing, then heat transfer efficiency is improved, but ease of serviceability deteriorates
Solution Approach 1:
The heat spreader is divided into a fixed portion attached to the housing and a moveable portion that can be independently manipulated. This segmentation maintains thermal contact for efficient heat transfer when needed while allowing the moveable portion to be adjusted or removed for serviceability, eliminating the need to compromise between heat transfer efficiency and ease of serviceability.
Solution Approach 2:
The heat spreader incorporates moveable portions that can dynamically change their position. When in the engaged position, they maintain efficient thermal contact with the housing; when moved away, they enable serviceability. This dynamic design resolves the contradiction by allowing the system to adapt its configuration based on operational requirements.
3Volume of moving object
If components are tightly packed, then space utilization is improved, but heat dissipation difficulty increases
Solution Approach 1:
The heat spreader is segmented into fixed and moveable portions, with the moveable portion designed to extend into the space between tightly packed electronic components. This segmentation allows the heat spreader to reach and cool components that would otherwise be inaccessible due to tight packing, thereby improving heat dissipation without requiring increased space.
Solution Approach 2:
The moveable heat spreader extends in a dimension perpendicular to the housing surface, reaching into the gap between the housing and the electronic components. This dimensional approach allows effective heat dissipation from tightly packed components without compromising space utilization within the enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The moveable heat spreaders enable effective heat dissipation by conducting heat to cold plates, enhancing cooling efficiency while allowing for easy installation and removal of electronic devices within the enclosure.
Implementation Method 1
The at least one outer wedge is configured to be in slidable contact with the at least one wedge such that pressing the at least one moveable heat spreader in a first direction causes the moveable heat spreader to slide against the heat spreader and move away from the housing
Implementation Method 2
The heat spreader is coupled to at least one surface of the housing... The moveable heat spreader is coupled to the heat spreader... enable effective heat dissipation by conducting heat to cold plates
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.