Moveable Vacuum Transfer Module for Semiconductor Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing systems face inefficiencies in space utilization, increased costs, and reduced accuracy due to radial cluster and linear implementations, which require larger chambers, multiple robots, and increased particle generation, leading to wasted space and higher maintenance complexities.
Innovation Solution
A moveable vacuum transfer module (VTM) system that aligns with multiple process modules using a single robot, reducing the overall footprint and particle generation, and allowing for easier maintenance and scalability by being independent of process module pitch, with configurations enabling movement along multiple axes and rotation to access various positions efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If radial cluster or linear implementations are used, then substrate processing can be performed, but space utilization is poor and device footprint is large
Solution Approach 1:
The VTM is made movable along the linear direction instead of being stationary, allowing it to dynamically position itself between different process modules. This dynamic positioning enables a single compact VTM to serve multiple process modules sequentially, dramatically reducing the overall device footprint while maintaining high substrate processing efficiency through continuous movement and operation.
2Ease of operation
If multiple robots are used in radial cluster implementation, then substrate transfer can be performed, but device complexity and maintenance requirements increase
Solution Approach 1:
A single VTM is designed to perform multiple functions by sequentially accessing different process modules through linear movement. This universal VTM replaces the need for multiple dedicated robots, reducing device complexity while maintaining full substrate transfer capability across all process modules. The VTM can service any process module in the linear array, making it a multi-functional replacement for multiple specialized components.
Solution Approach 2:
Multiple substrate transfer functions that would traditionally require separate robots are merged into a single VTM system. By combining these functions into one movable unit, the system reduces the number of components, simplifies maintenance, and lowers overall device complexity while preserving the ability to perform substrate transfer operations across all process modules.
3Adaptability or versatility
If larger chambers are used to accommodate multiple process modules, then all modules can be accessed, but space utilization decreases and costs increase
Solution Approach 1:
The system transitions from a radial two-dimensional layout to a linear one-dimensional arrangement, allowing process modules to be arranged in a compact linear sequence. The VTM moves along this linear dimension to access different modules, enabling high adaptability and access to multiple process modules within a significantly reduced footprint compared to radial cluster configurations.
4Productivity
If radial cluster implementation is used, then substrate processing can be performed, but particle generation increases
Solution Approach 1:
The patent addresses particle generation by implementing a linear configuration with a movable VTM that reduces the overall chamber volume and minimizes internal surfaces where particles can generate and accumulate. The compact linear design inherently reduces particle generation sources while maintaining substrate processing capability, effectively converting the spatial constraint into a benefit for reducing harmful particle contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The moveable VTM system enhances substrate processing tool density, reduces costs and maintenance time, improves accuracy, and allows for flexible configuration with reduced particle generation and simplified servicing, while maintaining efficient vacuum sealing and transfer operations.
Implementation Method 1
The substrate processing tool further includes a vacuum pump configured to pump down a transfer volume between the gate valve and a respective one of the plurality of process modules
Implementation Method 2
The gate valve includes a port and a vacuum seal
Data Source
AI summary
A substrate processing tool includes a plurality of process modules configured to process a semiconductor substrate. Each of the plurality of process modules is arranged at a different location within the substrate processing tool. A vacuum transfer module (VTM) includes a robot and is configured to move between a plurality of different positions corresponding to the different locations within the substrate processing tool to allow the robot to access respective ones of the plurality of process modules.