Moving Blade Mold Cavities for High-Density Package Separation

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Solution Overview

Problem

The separation of molded packages from interdigitated lead frames is challenging due to offset positioning, leading to increased manufacturing costs and complexity with existing methods such as saw cutting and laser cutting.

Innovation Solution

A method involving a mold with column cavities and blade channels, where blades are inserted into the cavities to separate individual molded package structures along the column direction, reducing the need for prior pitch correction and subsequent cutting processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If saw cutting is used for package separation, then manufacturing precision can be maintained, but device complexity and manufacturing cost increase due to required column alignment and pitch correction

Engineering Contradiction:

Improvepackage separation precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The mold cavity is pre-configured with integrated cutting blades positioned to automatically separate packages during the molding process itself, eliminating the need for subsequent alignment and cutting operations. The blades are arranged to match the interdigitated lead frame pattern, enabling direct separation as molding compound is injected.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The package molding process and package separation process are merged into a single integrated operation. The cutting function is combined with the molding function, allowing both encapsulation and separation to occur simultaneously during one manufacturing cycle, thereby reducing overall process complexity.

Inventive Principle:

Principle #5Merging (Combining)

2Device complexity

If laser cutting is used for package separation, then manufacturing process is simplified, but productivity decreases due to time-consuming cutting operations

Engineering Contradiction:

Improvemanufacturing process complexityVSAvoidpackage separation speed

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The cutting action occurs continuously during the molding process rather than as a separate subsequent step. As molding compound is injected into the cavity, the integrated blades simultaneously perform separation, ensuring that the useful action of package separation continues without interruption throughout the molding cycle.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The separation capability is prepared in advance by integrating blades into the mold cavity structure before molding begins. This preliminary configuration allows separation to occur naturally during molding, eliminating the need for time-consuming post-molding laser cutting operations.

Inventive Principle:

Principle #10Preliminary action

3Quantity of substance

If interdigitated lead frames with offset positioning are used, then device density is increased, but manufacturing difficulty increases due to challenging package separation

Engineering Contradiction:

Improvedevice densityVSAvoidpackage separation ease

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

The mold cavity is designed with locally adapted features including integrated cutting blades positioned at specific locations corresponding to the interdigitated lead frame pattern. The cavity geometry and blade positions are customized to match the offset arrangement of individual packages, enabling easy separation despite the complex high-density layout.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20240055275A1Moving blade cavity technology for high dense units per strip design

Publication Date: 2024.02.15 TEXAS INSTRUMENTS INC

AI summary

A method of fabricating an electronic device includes injecting molding compound into respective column cavities of a mold to enclose semiconductor dies of respective unit regions of a lead frame panel in the respective column cavities and inserting a blade into the respective column cavities of the mold between adjacent unit regions of the lead frame panel to separate individual molded package structures in the respective column cavities of the mold along a column direction.