Moving Shield Rods for Sputtering Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The uniformity of thin layers formed on substrates in sputtering devices is compromised due to the presence of shield rods, which hinder the movement of target particles and lead to non-uniform deposition.
Innovation Solution
A sputtering device with moving shield rods and a shield mask that can move horizontally between the target and substrate, allowing for the formation of a uniform electric field and reducing particle hindrance, thereby enhancing deposition uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If shield rods are installed in the shield mask to form a uniform electric field, then the electric field uniformity is improved, but the target particles are hindered in their movement to the substrate, resulting in deteriorated thin layer uniformity
Solution Approach 1:
The shield rods are made movable along the first direction while maintaining their parallel arrangement. This dynamic configuration allows the shield rods to move out of the direct path of target particles, reducing their hindrance effect while preserving the uniform electric field formation capability. The movability enables the system to adapt between electric field uniformity and particle transport efficiency.
Solution Approach 2:
The shield mask is divided into multiple segments (shield rods) that can move independently or collectively along the first direction. This segmentation allows selective positioning of individual rods to optimize both electric field distribution and particle flow paths, resolving the contradiction between field uniformity and particle transport.
2Reliability
If shield rods are positioned to form an electric field with the target, then the electric field distribution is improved, but the shield rods lie in the path of target particles, causing non-uniform deposition
Solution Approach 1:
The shield rods are configured to move in the first direction, allowing them to dynamically adjust their positions. During operation, they can be positioned to form the necessary electric field with the target, then moved to clear the particle path, ensuring both reliable electric field formation and uniform deposition.
Solution Approach 2:
The shield rods are arranged to extend along the second direction (perpendicular to the first direction) and move along the first direction. This dimensional arrangement allows the rods to form electric fields effectively in one dimension while moving to clear particle paths in another dimension, resolving the spatial conflict between field formation and particle transport.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The moving shield rods and mask configuration improves the uniformity of thin layer deposition by minimizing particle hindrance, resulting in a more uniform thin layer formation on substrates.
Implementation Method 1
Power is supplied to a target installed within a chamber, and an inert gas such as an argon gas or an oxygen (O2) gas is injected into the chamber. Then, an electric field is formed between the substrate and the target. The inert gas is ionized by the electric field to create plasma
Implementation Method 2
ions from the ionized inert gas collide with the target. Here, target particles are emitted from the target, and the emitted target particles are deposited on a substrate to form a thin layer
Data Source
AI summary
Provided are a sputtering device and a method of forming a layer using the same.The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.