Moving-Stage Additive Manufacturing for In-Process Component Mounting
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Solution Overview
Problem
Existing additive manufacturing apparatuses require frequent rearrangement and repositioning of three-dimensional articles during the manufacturing process, leading to inefficiencies and increased time for work process transitions, particularly when electronic component mounting is involved.
Innovation Solution
A manufacturing apparatus with a stage that moves in orthogonal directions, integrating a shaping unit for layer formation and a mounting unit for electronic component placement, allowing sequential movement along a predetermined path to minimize process transitions and enable continuous additive manufacturing without article repositioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the three-dimensional article is removed from the printing device during each work process (insulating layer shaping, wiring pattern shaping, electronic component mounting), then each process can be performed by dedicated equipment, but the article needs to be rearranged and repositioned between devices, resulting in time loss and process discontinuity
Solution Approach 1:
The patent combines multiple work units (insulating layer shaping unit, wiring pattern shaping unit, and electronic component mounting unit) into a single integrated manufacturing apparatus. The stage can move sequentially among these units without removing the three-dimensional article, eliminating transfer time and maintaining process continuity. This merging of previously separate operations into one coordinated system directly resolves the contradiction between process reliability and time loss.
2Adaptability or versatility
If multiple separate devices are used for different work processes (shaping, mounting), then each device can be optimized for its specific function, but the article must be transferred and repositioned between devices, complicating the overall system and reducing efficiency
Solution Approach 1:
The patent creates a universal manufacturing apparatus that performs multiple functions (insulating layer shaping, wiring pattern shaping, electronic component mounting) within a single integrated system. The stage serves as a common platform that moves among different work units, allowing each unit to maintain its functional specialization while eliminating the need for article transfer between separate devices. This multi-functionality approach resolves the contradiction between adaptability and productivity.
3Ease of manufacture
If the article is frequently removed and repositioned during manufacturing, then different processes can be performed by specialized equipment, but this results in lack of smooth work process transition and increased manufacturing time
Solution Approach 1:
The patent merges multiple specialized work processes into a single integrated apparatus where the stage moves sequentially among different work units. This eliminates the need to remove and reposition the article between separate devices, ensuring smooth work process transition while maintaining the flexibility of specialized operations. The integration directly addresses the contradiction between ease of manufacture and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the time required for work process transitions, allows for a more streamlined manufacturing process, and enables the production of complex electronic devices like multilayer wiring boards with reduced size and increased efficiency, suitable for low-volume production such as test circuits.
Implementation Method 1
This flat plate-shaped material is melted by being exposed to laser light, and solidifies with time to become a layered article
Implementation Method 2
a mounting unit that is disposed within the range in which the stage can be moved and mounts an electronic component on a layered workpiece formed by the shaping unit
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Manufacturing apparatus 10 includes conveyance device 11 that moves stage 27, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. In addition, first shaping unit 13, second shaping unit 15, and component mounting unit 17 are arranged within a range in which stage 27 can move. Manufacturing apparatus 10 performs additive manufacturing of the electronic device on stage 27 by performing a sequential movement of stage 27 to respective working positions of units 13, 15, and 17. As a result, in this manufacturing apparatus 10, a workpiece on stage 27 does not have to be removed and repositioned during each work process such as shaping by first shaping unit 13, shaping by second shaping unit 15, and electronic component mounting by component mounting unit 17.