Moving Semiconductor Substrate Support with Integrated Local Controller
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Solution Overview
Problem
In semiconductor substrate handling, providing reliable power and communication connections between controllers and moving semiconductor substrate supports is challenging due to rapid and large translations in the XY plane, along with rotational requirements exceeding 180°, which complicates mechanical functions and limits control precision.
Innovation Solution
Incorporating a vacuum system with local controllers that move with the substrate support, including a top plate with integrated control mechanisms and sensors, to simplify connections and enhance control input, using rotary couplings and wireless connectivity for efficient power and communication management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional stationary controllers are used to control moving substrate supports, then connection complexity increases, but control precision and reliability deteriorate
Solution Approach 1:
The controller is made dynamic by mounting it on the substrate support itself, allowing it to move with the support during XY translations and rotations. This eliminates the need for complex flexible connections between stationary and moving components, as the controller now resides in the moving frame where it directly controls local mechanisms without requiring long flexible cables or rotary couplings.
Solution Approach 2:
The substrate support becomes self-controlling by integrating the controller directly onto its structure. The controller monitors and adjusts the position and orientation of the support it is mounted on, creating a self-regulating system that improves reliability by eliminating external connection dependencies while maintaining precise control of the support's motion.
2Adaptability or versatility
If flexible connections are used for power and communication, then movement range increases, but connection reliability deteriorates
Solution Approach 1:
The patent replaces mechanical flexible cable connections with wireless communication technologies for data transmission between the moving substrate support and external systems. This substitution eliminates the mechanical wear and signal interference problems associated with flexible cables during large XY translations and 180°+ rotations, maintaining both movement freedom and connection reliability.
3Device complexity
If mechanical functions are simplified on substrate support, then connection complexity decreases, but control capability deteriorates
Solution Approach 1:
The substrate support is designed with multi-functionality by integrating multiple control mechanisms directly onto its structure. The support incorporates XY translation capabilities, rotational capability exceeding 180°, and localized control mechanisms all in one unit, eliminating the need for complex external mechanical linkages while maintaining full control capability for precise substrate positioning and orientation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies control operations, improves connection reliability, and enables precise positioning and data transfer between the substrate and external systems, enhancing the ability to perform complex mechanical functions on semiconductor substrates during inspection and processing.
Implementation Method 1
a vacuum system coupled with a top plate that supports a semiconductor substrate
Data Source
AI summary
A moveable semiconductor substrate support includes a control device receiving data from one or more sensors and providing control signals to one or more actuators. The control device is coupled to and moves with the moveable substrate support to facilitate flexible and complex operation of the substrate support itself.