Moving Deposition Source for Uniform Thin-Film Curing
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Solution Overview
Problem
Conventional thin film deposition apparatuses for organic light emitting display devices are inefficient, particularly when handling large-sized substrates, as they require separate chambers for deposition and hardening, leading to increased footprint and tact time.
Innovation Solution
A thin film deposition apparatus with a substrate supporting unit and a deposition source shifting unit, where the deposition source includes an evaporation room, a nozzle unit, and a light radiating unit to evaporate and deposit the material uniformly on the substrate, allowing for simultaneous deposition and hardening in a single step, reducing the apparatus length and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate chambers are used for deposition and hardening, then the deposition process can be performed, but the apparatus footprint and tact time increase
Solution Approach 1:
The patent combines the deposition chamber and hardening chamber into a single integrated chamber. The deposition source and light radiating unit are both positioned within the same chamber, allowing deposition and UV hardening to occur simultaneously in one space rather than requiring separate chambers, thereby reducing the overall apparatus footprint while maintaining deposition efficiency
Solution Approach 2:
The single chamber serves multiple functions: it acts as both the deposition chamber for material evaporation and the hardening chamber for UV curing. This multi-functional design eliminates the need for separate dedicated chambers, reducing space requirements while enabling sequential or simultaneous operation of deposition and hardening processes
2Productivity
If separate chambers are used for deposition and hardening, then the deposition process can be performed, but the tact time increases
Solution Approach 1:
The patent enables continuous operation by eliminating the need to transfer substrates between separate deposition and hardening chambers. The deposition source deposits material and the light radiating unit immediately follows up with UV hardening within the same chamber, creating a continuous process flow without interruption or transfer time, thereby reducing total tact time while maintaining high deposition efficiency
Solution Approach 2:
By merging the deposition and hardening functions into one chamber, the patent eliminates the time required for substrate transfer between chambers. The process becomes a single-step operation where deposition and hardening occur in sequence or simultaneously within the same space, significantly reducing the overall tact time compared to multi-chamber systems
3Manufacturing precision
If the deposition source is stationary, then the structure is simple, but uniform deposition on large substrates cannot be achieved
Solution Approach 1:
The patent introduces a deposition source shifting unit that moves the deposition source along the substrate surface. This dynamic positioning allows the deposition source to scan across large substrate areas, ensuring uniform material distribution. The shifting mechanism is integrated into the chamber structure, adding minimal complexity while achieving the required deposition uniformity across large substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient deposition and hardening of thin films on large-sized substrates with reduced footprint and tact time, ensuring uniform deposition and improved light emitting characteristics.
Implementation Method 1
a first heater surrounding the container and heating the inner space of the container
Implementation Method 2
a spray nozzle joined with the container and atomizing a liquefied deposition material into the inner space of the container
Implementation Method 3
a light radiating unit placed at one side of the nozzle unit and radiating light to harden a region of the substrate where the deposition material is deposited
Implementation Method 4
the deposition material is evaporated to generate the steam of the deposition material
Data Source
AI summary
A thin film deposition apparatus includes a substrate supporting unit supporting a substrate, a deposition source evaporating a deposition material to supply a steam of the deposition material to the substrate, and a deposition source shifting unit moving the deposition source so that the deposition source is relatively shifted with respect to the substrate supporting unit.