MOVPE-Grown Mid-Infrared Light Receiving Layer for Dark Current Suppression

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Solution Overview

Problem

Semiconductor devices intended for the mid-infrared range exhibit high dark current values, especially at low temperatures, which limits their performance and requires cooling, despite advancements in Type II superlattice structures like InAs/GaSb multiple quantum well structures.

Innovation Solution

A semiconductor device with a light receiving layer grown using the metal-organic vapor phase epitaxy method, featuring a reduced crystal defect density and impurity concentration, achieving a cutoff wavelength of 3 μm to 8 μm and a dark current density of less than 1×10−1 A/cm² at −140° C. under a 60 mV reverse bias, utilizing a type II quantum well structure with GaSb and InAs layers and a strain compensation layer to enhance crystal quality and reduce generation current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a light receiving layer is grown by the molecular beam epitaxy (MBE) method to achieve a type II superlattice structure, then the crystal structure can be formed, but the dark current exhibits a value higher than an ideal value in the low temperature region at less than or equal to −140° C. due to generation current

Engineering Contradiction:
Improvedark current suppressionVSAvoidmanufacturing process limitation
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the growth method from MBE to metal-organic vapor phase epitaxy (MOVPE), which fundamentally alters the manufacturing parameters. This parameter change enables better suppression of generation current at low temperatures while maintaining the type II superlattice structure, achieving dark current density of less than or equal to 1×10^-1 A/cm² at −140° C.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite semiconductor layer structure consisting of multiple layers including InAs/GaSb type II superlattice layers, InAlAs barrier layers, and InGaAs contact layers. This composite structure optimizes both the light receiving performance and dark current characteristics by combining materials with different properties in a multi-layer configuration.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the operating temperature is set low to reduce dark current in mid-infrared light receiving devices, then dark current can be reduced, but a cooling apparatus is required and manufacturing complexity increases

Engineering Contradiction:
Improvedark current reductionVSAvoidcooling apparatus requirement
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the growth method to MOVPE, which produces semiconductor layers with fewer crystal defects and lower impurity concentrations. This parameter change in the manufacturing process inherently reduces generation current, allowing the device to achieve low dark current without requiring complex cooling apparatus, thereby simplifying the overall device structure.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If the light receiving layer is designed to receive light in the mid-infrared range with cutoff wavelength of 3 μm to 8 μm, then light reception capability is improved, but dark current density increases

Engineering Contradiction:
Improvelight reception rangeVSAvoiddark current density
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses a composite structure of InAs/GaSb type II superlattice layers combined with InAlAs barrier layers and InGaAs contact layers. This composite material structure enables the light receiving layer to maintain high adaptability for mid-infrared light reception (cutoff wavelength 3-8 μm) while simultaneously suppressing dark current density through the optimized material composition and layer configuration.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by creating distinct regions with different material compositions and properties within the semiconductor layer laminate. The InAs/GaSb superlattice regions are optimized for light absorption, while InAlAs barrier regions are optimized for carrier confinement and defect reduction, and InGaAs contact regions are optimized for electrical contact. This local optimization allows simultaneous achievement of high light reception capability and low dark current density.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses dark current density to low levels at both low and high temperatures, enabling efficient light reception in the mid-infrared range with improved crystal quality and manufacturing efficiency, suitable for mass production.

Implementation Method 1

a light receiving layer (4), the light receiving layer having a cutoff wavelength of more than or equal to 3 μm and less than or equal to 8 μm

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

the light receiving layer being grown by a metal-organic vapor phase epitaxy method

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS9123843B2Semiconductor device
Publication Date: 2015.09.01 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US9123843B2 patent drawing
  • US9123843B2 patent drawing
  • US9123843B2 patent drawing

AI summary

A semiconductor device includes a semiconductor layer laminate in which a plurality of semiconductor layers are laminated, the semiconductor layer laminate including a light receiving layer, the light receiving layer being grown by a metal-organic vapor phase epitaxy method, the light receiving layer having a cutoff wavelength of more than or equal to 3 μm and less than or equal to 8 μm, the semiconductor device having a dark current density of less than or equal to 1×10−1 A/cm2 when a reverse bias voltage of 60 mV is applied at a temperature of −140° C. Thereby, a semiconductor device which can receive light in a mid-infrared range and has a low dark current is provided.