3D Magnetic Shielding Layout for Perpendicular MRAM
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Solution Overview
Problem
Magnetic memory devices, such as MRAMs, are vulnerable to external or stray magnetic fields that can alter their magnetization, leading to incorrect operation and data integrity issues, especially in environments with excessive stray magnetic fields, where existing shielding techniques for in-plane magnetization are insufficient to protect devices with perpendicular magnetization.
Innovation Solution
The implementation of magnetic shielding configurations that extend along the z-axis, using multiple layers of magnetic materials on the top, bottom, and sides of the magnetic device, forming voids to expose side surfaces and shunt both in-plane and out-of-plane magnetization fields, thereby protecting the device from external magnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional magnetic shielding is used for in-plane magnetization, then in-plane magnetic fields are shielded, but perpendicular magnetization along the z-axis is not protected
Solution Approach 1:
The patent transitions from traditional in-plane (x-y plane) magnetic shielding to three-dimensional shielding that includes the z-axis dimension. Magnetic shielding structures are positioned above and below the magnetic device to provide shielding along the perpendicular direction, completing the spatial coverage of all three axes (x, y, z) and enabling protection for perpendicular magnetization orientations.
2Reliability
If magnetic shielding structures are added to protect from external magnetic fields, then data integrity is improved, but device complexity increases
Solution Approach 1:
The magnetic shielding structures serve multiple functions simultaneously: they shield against external magnetic fields affecting data integrity, provide structural support for the memory device, and can be integrated with existing packaging materials. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity while maintaining reliability improvements.
3Productivity
If memory device size is reduced to increase density, then storage capacity per unit area increases, but susceptibility to magnetic interference increases
Solution Approach 1:
The magnetic shielding structures are nested within or around the memory device packaging in a space-efficient manner. The shields are positioned to maximize protective coverage while minimizing the increase in overall device footprint, allowing small form factor memory devices to maintain adequate shielding against magnetic interference despite their reduced size and increased density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively shields magnetic memory devices from external magnetic fields along all three axes, enhancing data integrity and allowing for higher memory density, lower power consumption, and lower cost per bit, while maintaining robust operation in critical applications.
Implementation Method 1
Magnetic shielding may protect magnetic devices, such as magnetic memory devices, from external or stray magnetic fields. For example, plates of magnetic material may be placed on a top and a bottom of a single chip package or a multi-chip module to help prevent the external or stray magnetic fields from altering in-plane magnetization of magnetic devices.
Data Source
AI summary
An example apparatus includes a magnetic device, top magnetic shielding, bottom magnetic shielding, and a plurality of side magnetic shielding elements. The top magnetic shielding includes a first magnetic material. The bottom magnetic shielding includes a second magnetic material. Each side magnetic shielding element of the plurality of side magnetic shielding elements includes a third magnetic material. Each one of the plurality of side magnetic shielding elements extend at least partially between the top surface of the magnetic device and the bottom surface of the magnetic device. The plurality of side magnetic shielding elements only partially extends over a first side surface.