Crystalline Metal Nitride Buffer Layer for MRAM

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Solution Overview

Problem

The degradation of crystallinity in metal nitride buffer layers used in magnetoresistive random access memory (MRAM) devices leads to compromised magnetic properties and metal diffusion issues, which are not effectively addressed by existing methods that either degrade crystallinity or fail to prevent diffusion.

Innovation Solution

Forming a crystalline metal nitride buffer layer by nitriding a metal buffer layer, such as Nb or Hf, to enhance crystallinity and prevent metal diffusion, thereby improving the magnetic properties of the magnetoresistive tunnel junction (MTJ) element without requiring high-temperature treatments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-generated harmful factors

If a metal nitride buffer layer is used to prevent metal diffusion, then metal diffusion is suppressed, but the crystallinity of the buffer layer is degraded

Engineering Contradiction:
Improvemetal diffusionVSAvoidcrystallinity
Core Design Contradiction:
Object-generated harmful factorsVSStability of the object's composition

Solution Approach 1:

The buffer layer is divided into two distinct layers: a metal buffer layer (first buffer layer) and a metal nitride buffer layer (second buffer layer). The metal buffer layer maintains good crystallinity while the metal nitride buffer layer prevents metal diffusion, allowing each layer to fulfill its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

2Stability of the object's composition

If high-temperature treatments are applied to enhance crystallinity, then crystallinity is improved, but the magnetic properties of the MTJ element are degraded

Engineering Contradiction:
ImprovecrystallinityVSAvoidmagnetic properties
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The invention changes the chemical composition parameter by introducing a metal nitride layer (different from pure metal) to achieve the desired crystallinity and diffusion prevention without requiring high-temperature thermal treatment, thereby preserving the magnetic properties of the MTJ element.

Inventive Principle:
Principle #35Parameter changes

3Object-generated harmful factors

If the crystallinity of the buffer layer is degraded, then metal diffusion is suppressed, but the magnetic properties are compromised

Engineering Contradiction:
Improvemetal diffusion suppressionVSAvoidmagnetic properties
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The buffer layer is divided into two distinct layers: a metal buffer layer (first buffer layer) and a metal nitride buffer layer (second buffer layer). The metal buffer layer maintains good crystallinity while the metal nitride buffer layer prevents metal diffusion, allowing each layer to fulfill its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the magnetic properties of the MTJ element, suppresses metal diffusion, and maintains good crystallinity, resulting in improved performance and heat resistance for MRAM devices.

Implementation Method 1

forming a crystalline metal nitride buffer layer by nitriding a metal buffer layer

Methodology Applied
Scientific EffectNitriding: Nitriding

Data Source

PatentUS9640584B2Method of manufacturing a magnetoresistive memory device
Publication Date: 2017.05.02 KIOXIA CORP
  • US9640584B2 patent drawing
  • US9640584B2 patent drawing
  • US9640584B2 patent drawing

AI summary

According to one embodiment, a magnetoresistive memory device, includes a metal buffer layer provided on a substrate, a crystalline metal nitride buffer layer provided on the metal buffer layer, and a magnetoresistive element provided on the metal nitride buffer layer. The metal nitride buffer layer and the metal buffer layer contain a same material.