Soft Magnetic Resin Shield for MRAM External Field Suppression
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Solution Overview
Problem
Conventional MRAMs require a magnetic shield to prevent external magnetic fields from affecting the semiconductor chip, but the use of resin as a magnetic shield material is ineffective due to its low magnetic permeability, which blocks the flow of magnetism and fails to suppress external magnetic fields effectively.
Innovation Solution
A semiconductor device structure featuring a lower and upper magnetic shield member made of soft magnetic resin, directly in contact with each other, with the semiconductor chip positioned between them, ensuring unobstructed magnetism flow and effective suppression of external magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin is used as magnetic shield material connecting the first and second magnetic shield members, then the structural connection is achieved, but the magnetic shielding effectiveness deteriorates due to low magnetic permeability blocking magnetism flow
Solution Approach 1:
The patent introduces a magnetic conductor as an intermediary component between the first and second magnetic shield members. This magnetic conductor has high magnetic permeability and serves as a mediator to conduct magnetic flux, overcoming the blocking effect of the resin material while maintaining the structural connection provided by the resin.
Solution Approach 2:
The patent employs a composite structure combining resin and magnetic conductor materials. The resin provides structural bonding and insulation, while the magnetic conductor provides magnetic flux conduction pathways. This composite approach leverages the advantages of both materials to achieve both structural connection and effective magnetic shielding.
2Device complexity
If magnetic shield members are disposed with spacing to accommodate resin, then the package structure is simplified, but the magnetic shielding performance deteriorates due to interrupted magnetism flow
Solution Approach 1:
The magnetic conductor acts as a bridging intermediary that spans the gap between the first and second magnetic shield members. It maintains the simplified spaced structure while ensuring continuous magnetic flux flow through its high permeability path, effectively connecting the shield members magnetically despite the physical spacing.
Solution Approach 2:
The magnetic shielding function is segmented between the magnetic shield members (which provide the shield structure) and the magnetic conductor (which provides the flux conduction path). This segmentation allows the resin to be used for structural purposes without compromising magnetic continuity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the suppression of external magnetic fields, ensuring the semiconductor device operates effectively by utilizing soft magnetic resin with appropriate magnetic permeability and saturated magnetic flux density, thereby maintaining the integrity of the magnetic memory elements.
Implementation Method 1
the magnetic permeability of a resin is lower than that of a magnetic shield member. Therefore, when a resin is put between the first magnetic shield member and the second magnetic shield member, the flow of magnetism is blocked in the resin portion
Implementation Method 2
MRAMs cannot operate without a magnetic shield that prevents an external magnetic field from affecting an element (a semiconductor chip)
Data Source
AI summary
A semiconductor device includes a wiring substrate, a lower magnetic shield member, a semiconductor chip, and an upper magnetic shield member. The lower magnetic shield member is provided on the wiring substrate. The semiconductor chip is provided on the lower magnetic shield member. The semiconductor chip includes a magnetic memory element. The upper magnetic shield member is provided on the semiconductor chip. The semiconductor chip is disposed between the upper magnetic shield member and the lower magnetic shield member. The lower magnetic shield member and the upper magnetic shield member include a soft magnetic resin. The lower magnetic shield member and the upper magnetic shield member are in direct contact with each other.