Hybrid Exchange Coupling Structure for MRAM Reference Layer Stability

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Solution Overview

Problem

Magnetic random access memory (MRAM) technologies face challenges in achieving stable magnetic reference layers with high thermal and magnetic stability, particularly due to issues with interfacial mixing and diffusion at high processing temperatures, which affect the thickness and roughness of magnetic layers and reduce data density.

Innovation Solution

A novel exchange coupling structure is introduced, comprising a Ru layer of 0.4-0.9 nm thickness sandwiched between two Ir layers of 0.2-0.5 nm thickness, which provides strong RKKY exchange field and interfacial perpendicular magnetic anisotropy, while preventing Co diffusion and enhancing magnetic stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high processing temperatures are used to achieve stable magnetic reference layers, then magnetic stability is improved, but interfacial mixing and diffusion increase causing layer thickness and roughness degradation

Engineering Contradiction:
Improvemagnetic reference layer stabilityVSAvoidlayer thickness and roughness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

A TaOx barrier layer is introduced as an intermediary between the magnetic reference layer and adjacent layers. This barrier layer prevents interfacial mixing and diffusion caused by high processing temperatures, thereby maintaining layer thickness precision and surface roughness while still allowing the magnetic reference layer to achieve thermal stability through high-temperature processing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The magnetic reference layer structure is designed as a composite comprising multiple layers including CoFeB, CoFe, and TaOx materials. This composite structure combines the high magnetic stability of CoFeB with the diffusion barrier properties of TaOx, enabling the system to withstand high processing temperatures without suffering from interfacial degradation.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If exchange coupling structure is optimized to prevent Co diffusion, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improvelayer thickness controlVSAvoidexchange coupling structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The exchange coupling structure is segmented into distinct functional layers: a TaOx barrier layer for diffusion prevention, followed by controlled thicknesses of CoFeB and CoFe layers. Each segment performs a specific function - the TaOx layer prevents Co diffusion, while the CoFeB and CoFe layers provide the necessary magnetic properties. This segmentation enables precise control of layer thicknesses without requiring complex monolithic structures.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This hybrid exchange coupling structure improves the magnetic and thermal stability of the antiferromagnetic structure, maintaining high RKKY exchange field strength while preventing interfacial mixing and diffusion, thus ensuring robust magnetic stability and data integrity even at high temperatures.

Implementation Method 1

provides strong RKKY exchange field

Methodology Applied
Scientific EffectRKKY exchange interaction:

Implementation Method 2

provides strong RKKY exchange field and interfacial perpendicular magnetic anisotropy

Methodology Applied
Scientific EffectInterfacial perpendicular magnetic anisotropy: Anisotropy

Implementation Method 3

preventing Co diffusion

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS10879454B2Magnetic tunnel junction memory element with improved reference layer stability for magnetic random access memory application
Publication Date: 2020.12.29 INTEGRATED SILICON SOLUTION CAYMAN INC
  • US10879454B2 patent drawing
  • US10879454B2 patent drawing
  • US10879454B2 patent drawing

AI summary

A magnetic memory element for using in magnetic random access memory. The magnetic memory element includes a novel exchange coupling layer for use in an antiferromagnetic structure for magnetically pinning a magnetic reference layer of the memory element. The exchange coupling layer is located between a first magnetic layer (reference layer) and a second magnetic layer (keeper layer). The exchange coupling layer includes a layer of Ru located between first and second layers of Ir. The Ir layers can be in contact with each of the first and second magnetic layers to provide an interfacial magnetic anisotropy, as well as providing RKKY exchange field. The Ru layer, provides an increased RKKY exchange field as a result of the high RKKY exchange coupling of Ru.